JPS59222949A - 超高周波集積化電子回路装置 - Google Patents

超高周波集積化電子回路装置

Info

Publication number
JPS59222949A
JPS59222949A JP58098445A JP9844583A JPS59222949A JP S59222949 A JPS59222949 A JP S59222949A JP 58098445 A JP58098445 A JP 58098445A JP 9844583 A JP9844583 A JP 9844583A JP S59222949 A JPS59222949 A JP S59222949A
Authority
JP
Japan
Prior art keywords
external connection
pad
electronic circuit
reference potential
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58098445A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0524666B2 (cg-RX-API-DMAC10.html
Inventor
Masahiro Hirayama
昌宏 平山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP58098445A priority Critical patent/JPS59222949A/ja
Publication of JPS59222949A publication Critical patent/JPS59222949A/ja
Publication of JPH0524666B2 publication Critical patent/JPH0524666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W44/20—
    • H10W44/206—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5473—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP58098445A 1983-06-02 1983-06-02 超高周波集積化電子回路装置 Granted JPS59222949A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58098445A JPS59222949A (ja) 1983-06-02 1983-06-02 超高周波集積化電子回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58098445A JPS59222949A (ja) 1983-06-02 1983-06-02 超高周波集積化電子回路装置

Publications (2)

Publication Number Publication Date
JPS59222949A true JPS59222949A (ja) 1984-12-14
JPH0524666B2 JPH0524666B2 (cg-RX-API-DMAC10.html) 1993-04-08

Family

ID=14219940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58098445A Granted JPS59222949A (ja) 1983-06-02 1983-06-02 超高周波集積化電子回路装置

Country Status (1)

Country Link
JP (1) JPS59222949A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2573272A1 (fr) * 1984-11-14 1986-05-16 Int Standard Electric Corp Procede de realisation d'un substrat comportant un conducteur coaxial
US4979016A (en) * 1988-05-16 1990-12-18 Dallas Semiconductor Corporation Split lead package
US5684332A (en) * 1994-05-27 1997-11-04 Advanced Semiconductor Engineering, Inc. Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2573272A1 (fr) * 1984-11-14 1986-05-16 Int Standard Electric Corp Procede de realisation d'un substrat comportant un conducteur coaxial
US4979016A (en) * 1988-05-16 1990-12-18 Dallas Semiconductor Corporation Split lead package
US5684332A (en) * 1994-05-27 1997-11-04 Advanced Semiconductor Engineering, Inc. Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom

Also Published As

Publication number Publication date
JPH0524666B2 (cg-RX-API-DMAC10.html) 1993-04-08

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