JPS59211253A - 電子部品パツケ−ジ - Google Patents

電子部品パツケ−ジ

Info

Publication number
JPS59211253A
JPS59211253A JP8717483A JP8717483A JPS59211253A JP S59211253 A JPS59211253 A JP S59211253A JP 8717483 A JP8717483 A JP 8717483A JP 8717483 A JP8717483 A JP 8717483A JP S59211253 A JPS59211253 A JP S59211253A
Authority
JP
Japan
Prior art keywords
layer
pin
solder
periphery
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8717483A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0150108B2 (enrdf_load_stackoverflow
Inventor
Koji Nose
幸之 野世
Shigeru Tanaka
茂 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP8717483A priority Critical patent/JPS59211253A/ja
Publication of JPS59211253A publication Critical patent/JPS59211253A/ja
Publication of JPH0150108B2 publication Critical patent/JPH0150108B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP8717483A 1983-05-17 1983-05-17 電子部品パツケ−ジ Granted JPS59211253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8717483A JPS59211253A (ja) 1983-05-17 1983-05-17 電子部品パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8717483A JPS59211253A (ja) 1983-05-17 1983-05-17 電子部品パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS59211253A true JPS59211253A (ja) 1984-11-30
JPH0150108B2 JPH0150108B2 (enrdf_load_stackoverflow) 1989-10-27

Family

ID=13907619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8717483A Granted JPS59211253A (ja) 1983-05-17 1983-05-17 電子部品パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS59211253A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61236148A (ja) * 1985-04-11 1986-10-21 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション メタライゼーシヨン・パターンへのろう付け方法
JPS63272061A (ja) * 1987-04-30 1988-11-09 Kyocera Corp プラグイン型半導体素子収納用パツケ−ジの製造方法
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc ELECTRIC CONTACT STRUCTURES OBTAINED BY CONFIGURATION OF A FLEXIBLE WIRE
EP0792519A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc COMPOSITE INTERCONNECTION ELEMENTS FOR MICROELECTRONIC COMPONENTS
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51106058A (ja) * 1975-03-14 1976-09-20 Citizen Watch Co Ltd Seramitsukukiban
JPS5544749A (en) * 1978-09-25 1980-03-29 Nec Corp Substrate for mounting semiconductor device
JPS5778651U (enrdf_load_stackoverflow) * 1980-10-30 1982-05-15
JPS599951A (ja) * 1982-07-09 1984-01-19 Hitachi Ltd 多層セラミツク基板のリ−ドピン取付構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51106058A (ja) * 1975-03-14 1976-09-20 Citizen Watch Co Ltd Seramitsukukiban
JPS5544749A (en) * 1978-09-25 1980-03-29 Nec Corp Substrate for mounting semiconductor device
JPS5778651U (enrdf_load_stackoverflow) * 1980-10-30 1982-05-15
JPS599951A (ja) * 1982-07-09 1984-01-19 Hitachi Ltd 多層セラミツク基板のリ−ドピン取付構造

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61236148A (ja) * 1985-04-11 1986-10-21 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション メタライゼーシヨン・パターンへのろう付け方法
JPS63272061A (ja) * 1987-04-30 1988-11-09 Kyocera Corp プラグイン型半導体素子収納用パツケ−ジの製造方法
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US7225538B2 (en) 1993-11-16 2007-06-05 Formfactor, Inc. Resilient contact structures formed and then attached to a substrate
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc ELECTRIC CONTACT STRUCTURES OBTAINED BY CONFIGURATION OF A FLEXIBLE WIRE
EP0792519A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc COMPOSITE INTERCONNECTION ELEMENTS FOR MICROELECTRONIC COMPONENTS
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

Also Published As

Publication number Publication date
JPH0150108B2 (enrdf_load_stackoverflow) 1989-10-27

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