JPS59209500A - 銅−半田クラツド材 - Google Patents
銅−半田クラツド材Info
- Publication number
- JPS59209500A JPS59209500A JP8315783A JP8315783A JPS59209500A JP S59209500 A JPS59209500 A JP S59209500A JP 8315783 A JP8315783 A JP 8315783A JP 8315783 A JP8315783 A JP 8315783A JP S59209500 A JPS59209500 A JP S59209500A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- copper
- materials
- clad material
- cladding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims description 67
- 229910000679 solder Inorganic materials 0.000 title claims description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 description 12
- 239000010959 steel Substances 0.000 description 12
- 238000005253 cladding Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8315783A JPS59209500A (ja) | 1983-05-12 | 1983-05-12 | 銅−半田クラツド材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8315783A JPS59209500A (ja) | 1983-05-12 | 1983-05-12 | 銅−半田クラツド材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59209500A true JPS59209500A (ja) | 1984-11-28 |
JPH0339798B2 JPH0339798B2 (enrdf_load_stackoverflow) | 1991-06-14 |
Family
ID=13794406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8315783A Granted JPS59209500A (ja) | 1983-05-12 | 1983-05-12 | 銅−半田クラツド材 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59209500A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63141734A (ja) * | 1986-12-04 | 1988-06-14 | 住友特殊金属株式会社 | クラツド板 |
CN104400339A (zh) * | 2014-10-28 | 2015-03-11 | 东莞市中一合金科技有限公司 | 连续条复焊料带材加工工艺及焊料带材 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5474248A (en) * | 1977-11-24 | 1979-06-14 | Hitachi Cable Ltd | Clad solder |
-
1983
- 1983-05-12 JP JP8315783A patent/JPS59209500A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5474248A (en) * | 1977-11-24 | 1979-06-14 | Hitachi Cable Ltd | Clad solder |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63141734A (ja) * | 1986-12-04 | 1988-06-14 | 住友特殊金属株式会社 | クラツド板 |
CN104400339A (zh) * | 2014-10-28 | 2015-03-11 | 东莞市中一合金科技有限公司 | 连续条复焊料带材加工工艺及焊料带材 |
Also Published As
Publication number | Publication date |
---|---|
JPH0339798B2 (enrdf_load_stackoverflow) | 1991-06-14 |
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