JPS59200763A - スパツタリング装置 - Google Patents

スパツタリング装置

Info

Publication number
JPS59200763A
JPS59200763A JP7656983A JP7656983A JPS59200763A JP S59200763 A JPS59200763 A JP S59200763A JP 7656983 A JP7656983 A JP 7656983A JP 7656983 A JP7656983 A JP 7656983A JP S59200763 A JPS59200763 A JP S59200763A
Authority
JP
Japan
Prior art keywords
target
pole
magnet
sputtering
gun
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7656983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6357502B2 (enrdf_load_stackoverflow
Inventor
Toru Takeuchi
竹内　透
Yasuhisa Sato
泰久 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7656983A priority Critical patent/JPS59200763A/ja
Publication of JPS59200763A publication Critical patent/JPS59200763A/ja
Publication of JPS6357502B2 publication Critical patent/JPS6357502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP7656983A 1983-04-30 1983-04-30 スパツタリング装置 Granted JPS59200763A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7656983A JPS59200763A (ja) 1983-04-30 1983-04-30 スパツタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7656983A JPS59200763A (ja) 1983-04-30 1983-04-30 スパツタリング装置

Publications (2)

Publication Number Publication Date
JPS59200763A true JPS59200763A (ja) 1984-11-14
JPS6357502B2 JPS6357502B2 (enrdf_load_stackoverflow) 1988-11-11

Family

ID=13608859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7656983A Granted JPS59200763A (ja) 1983-04-30 1983-04-30 スパツタリング装置

Country Status (1)

Country Link
JP (1) JPS59200763A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0980090A3 (de) * 1998-08-10 2004-12-01 Applied Films GmbH & Co. KG Zerstäubungsvorrichtung mit einer Kathode mit Permanentmagnetanordnung
WO2013115030A1 (ja) * 2012-01-30 2013-08-08 日立金属株式会社 マグネトロンスパッタリング用磁場発生装置
CN103668096A (zh) * 2013-12-26 2014-03-26 京东方科技集团股份有限公司 条形磁铁、磁靶及磁控溅射设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5980925A (en) 1997-12-30 1999-11-09 Ethicon, Inc. High glycerin containing anti-microbial cleansers
AU2001253777B2 (en) 2000-04-28 2005-05-19 Ecolab Inc. Antimicrobial composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337588A (en) * 1976-09-21 1978-04-06 Toshiba Corp Sputtering electrode

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337588A (en) * 1976-09-21 1978-04-06 Toshiba Corp Sputtering electrode

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0980090A3 (de) * 1998-08-10 2004-12-01 Applied Films GmbH & Co. KG Zerstäubungsvorrichtung mit einer Kathode mit Permanentmagnetanordnung
WO2013115030A1 (ja) * 2012-01-30 2013-08-08 日立金属株式会社 マグネトロンスパッタリング用磁場発生装置
CN103668096A (zh) * 2013-12-26 2014-03-26 京东方科技集团股份有限公司 条形磁铁、磁靶及磁控溅射设备

Also Published As

Publication number Publication date
JPS6357502B2 (enrdf_load_stackoverflow) 1988-11-11

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