JPS59188944A - チツプキヤリア - Google Patents

チツプキヤリア

Info

Publication number
JPS59188944A
JPS59188944A JP58062206A JP6220683A JPS59188944A JP S59188944 A JPS59188944 A JP S59188944A JP 58062206 A JP58062206 A JP 58062206A JP 6220683 A JP6220683 A JP 6220683A JP S59188944 A JPS59188944 A JP S59188944A
Authority
JP
Japan
Prior art keywords
chip carrier
pads
semiconductor component
cover
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58062206A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6353697B2 (enExample
Inventor
Hiroyuki Hamaguchi
博幸 濱口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58062206A priority Critical patent/JPS59188944A/ja
Publication of JPS59188944A publication Critical patent/JPS59188944A/ja
Publication of JPS6353697B2 publication Critical patent/JPS6353697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/153
    • H10W40/22

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58062206A 1983-04-11 1983-04-11 チツプキヤリア Granted JPS59188944A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58062206A JPS59188944A (ja) 1983-04-11 1983-04-11 チツプキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58062206A JPS59188944A (ja) 1983-04-11 1983-04-11 チツプキヤリア

Publications (2)

Publication Number Publication Date
JPS59188944A true JPS59188944A (ja) 1984-10-26
JPS6353697B2 JPS6353697B2 (enExample) 1988-10-25

Family

ID=13193435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58062206A Granted JPS59188944A (ja) 1983-04-11 1983-04-11 チツプキヤリア

Country Status (1)

Country Link
JP (1) JPS59188944A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003103043A1 (en) * 2002-04-05 2003-12-11 Intel Corporation Heat spreader with down set leg attachment feature

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003103043A1 (en) * 2002-04-05 2003-12-11 Intel Corporation Heat spreader with down set leg attachment feature
US6756669B2 (en) 2002-04-05 2004-06-29 Intel Corporation Heat spreader with down set leg attachment feature
US7015073B2 (en) 2002-04-05 2006-03-21 Intel Corporation Method of forming heat spreader with down set leg attachment feature
CN100359676C (zh) * 2002-04-05 2008-01-02 英特尔公司 具有向下支架附着特征的热扩散器

Also Published As

Publication number Publication date
JPS6353697B2 (enExample) 1988-10-25

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