JPS5918647A - 半導体装置の製造装置 - Google Patents
半導体装置の製造装置Info
- Publication number
- JPS5918647A JPS5918647A JP57127925A JP12792582A JPS5918647A JP S5918647 A JPS5918647 A JP S5918647A JP 57127925 A JP57127925 A JP 57127925A JP 12792582 A JP12792582 A JP 12792582A JP S5918647 A JPS5918647 A JP S5918647A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- outer lead
- junction board
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title description 4
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 238000000465 moulding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57127925A JPS5918647A (ja) | 1982-07-22 | 1982-07-22 | 半導体装置の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57127925A JPS5918647A (ja) | 1982-07-22 | 1982-07-22 | 半導体装置の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5918647A true JPS5918647A (ja) | 1984-01-31 |
| JPS6364900B2 JPS6364900B2 (enrdf_load_stackoverflow) | 1988-12-14 |
Family
ID=14972020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57127925A Granted JPS5918647A (ja) | 1982-07-22 | 1982-07-22 | 半導体装置の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918647A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62106339A (ja) * | 1985-11-05 | 1987-05-16 | Toray Ind Inc | 光学繊維の光伝送損失の高精度測定法 |
-
1982
- 1982-07-22 JP JP57127925A patent/JPS5918647A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62106339A (ja) * | 1985-11-05 | 1987-05-16 | Toray Ind Inc | 光学繊維の光伝送損失の高精度測定法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6364900B2 (enrdf_load_stackoverflow) | 1988-12-14 |
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