JPS59180463U - セラミツク多層配線基板 - Google Patents

セラミツク多層配線基板

Info

Publication number
JPS59180463U
JPS59180463U JP7414083U JP7414083U JPS59180463U JP S59180463 U JPS59180463 U JP S59180463U JP 7414083 U JP7414083 U JP 7414083U JP 7414083 U JP7414083 U JP 7414083U JP S59180463 U JPS59180463 U JP S59180463U
Authority
JP
Japan
Prior art keywords
wiring board
multilayer wiring
ceramic multilayer
separated
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7414083U
Other languages
English (en)
Japanese (ja)
Other versions
JPH027483Y2 (enrdf_load_stackoverflow
Inventor
伯田　達夫
進 西垣
照沼　一彦
峰広 外崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP7414083U priority Critical patent/JPS59180463U/ja
Publication of JPS59180463U publication Critical patent/JPS59180463U/ja
Application granted granted Critical
Publication of JPH027483Y2 publication Critical patent/JPH027483Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP7414083U 1983-05-18 1983-05-18 セラミツク多層配線基板 Granted JPS59180463U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7414083U JPS59180463U (ja) 1983-05-18 1983-05-18 セラミツク多層配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7414083U JPS59180463U (ja) 1983-05-18 1983-05-18 セラミツク多層配線基板

Publications (2)

Publication Number Publication Date
JPS59180463U true JPS59180463U (ja) 1984-12-01
JPH027483Y2 JPH027483Y2 (enrdf_load_stackoverflow) 1990-02-22

Family

ID=30204237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7414083U Granted JPS59180463U (ja) 1983-05-18 1983-05-18 セラミツク多層配線基板

Country Status (1)

Country Link
JP (1) JPS59180463U (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6416670U (enrdf_load_stackoverflow) * 1987-07-21 1989-01-27
WO2007125839A1 (ja) * 2006-04-25 2007-11-08 Sumida Corporation インバータ回路
WO2013108555A1 (ja) * 2012-01-17 2013-07-25 ローム株式会社 チップコンデンサおよびその製造方法
EP3929947A1 (en) * 2020-06-26 2021-12-29 Murata Manufacturing Co., Ltd. Method of fabricating a device comprising an electrical component with sub components connected using a plate to control an electrical parameter

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994022281A1 (en) * 1993-03-19 1994-09-29 Fujitsu Limited Laminated circuit board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4957363A (enrdf_load_stackoverflow) * 1972-10-04 1974-06-04
JPS50119815A (enrdf_load_stackoverflow) * 1974-03-08 1975-09-19
JPS51874U (enrdf_load_stackoverflow) * 1974-06-18 1976-01-06
JPS549867U (enrdf_load_stackoverflow) * 1977-06-24 1979-01-23
JPS5562721A (en) * 1978-11-02 1980-05-12 Tdk Electronics Co Ltd Laminated capacitor
JPS59132611A (ja) * 1983-01-20 1984-07-30 日本電気株式会社 コンデンサ複合基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4957363A (enrdf_load_stackoverflow) * 1972-10-04 1974-06-04
JPS50119815A (enrdf_load_stackoverflow) * 1974-03-08 1975-09-19
JPS51874U (enrdf_load_stackoverflow) * 1974-06-18 1976-01-06
JPS549867U (enrdf_load_stackoverflow) * 1977-06-24 1979-01-23
JPS5562721A (en) * 1978-11-02 1980-05-12 Tdk Electronics Co Ltd Laminated capacitor
JPS59132611A (ja) * 1983-01-20 1984-07-30 日本電気株式会社 コンデンサ複合基板

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6416670U (enrdf_load_stackoverflow) * 1987-07-21 1989-01-27
WO2007125839A1 (ja) * 2006-04-25 2007-11-08 Sumida Corporation インバータ回路
WO2013108555A1 (ja) * 2012-01-17 2013-07-25 ローム株式会社 チップコンデンサおよびその製造方法
JP2013168633A (ja) * 2012-01-17 2013-08-29 Rohm Co Ltd チップコンデンサおよびその製造方法
US9859061B2 (en) 2012-01-17 2018-01-02 Rohm Co., Ltd. Chip capacitor and method for manufacturing the same
US10304633B2 (en) 2012-01-17 2019-05-28 Rohm Co., Ltd. Chip capacitor and method for manufacturing the same
US10777360B2 (en) 2012-01-17 2020-09-15 Rohm Co., Ltd. Chip capacitor and method for manufacturing the same
EP3929947A1 (en) * 2020-06-26 2021-12-29 Murata Manufacturing Co., Ltd. Method of fabricating a device comprising an electrical component with sub components connected using a plate to control an electrical parameter

Also Published As

Publication number Publication date
JPH027483Y2 (enrdf_load_stackoverflow) 1990-02-22

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