JPS59172722A - アライメントマ−クの製造方法 - Google Patents
アライメントマ−クの製造方法Info
- Publication number
- JPS59172722A JPS59172722A JP58047025A JP4702583A JPS59172722A JP S59172722 A JPS59172722 A JP S59172722A JP 58047025 A JP58047025 A JP 58047025A JP 4702583 A JP4702583 A JP 4702583A JP S59172722 A JPS59172722 A JP S59172722A
- Authority
- JP
- Japan
- Prior art keywords
- film
- alignment mark
- oxide film
- alignment
- polycrystalline silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 229920005591 polysilicon Polymers 0.000 claims description 29
- 230000008569 process Effects 0.000 abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052710 silicon Inorganic materials 0.000 abstract description 4
- 239000010703 silicon Substances 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 96
- 238000010586 diagram Methods 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical group I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58047025A JPS59172722A (ja) | 1983-03-23 | 1983-03-23 | アライメントマ−クの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58047025A JPS59172722A (ja) | 1983-03-23 | 1983-03-23 | アライメントマ−クの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59172722A true JPS59172722A (ja) | 1984-09-29 |
| JPS6347330B2 JPS6347330B2 (enrdf_load_stackoverflow) | 1988-09-21 |
Family
ID=12763632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58047025A Granted JPS59172722A (ja) | 1983-03-23 | 1983-03-23 | アライメントマ−クの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59172722A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154127A (ja) * | 1984-12-27 | 1986-07-12 | Oki Electric Ind Co Ltd | ウエハ−アライメント・マ−ク |
| JPH02134808A (ja) * | 1988-11-16 | 1990-05-23 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH0377309A (ja) * | 1989-08-19 | 1991-04-02 | Fujitsu Ltd | 半導体装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5180777A (enrdf_load_stackoverflow) * | 1975-01-13 | 1976-07-14 | Hitachi Ltd | |
| JPS5662324A (en) * | 1979-10-26 | 1981-05-28 | Seiko Epson Corp | Semiconductor device position fitting method |
-
1983
- 1983-03-23 JP JP58047025A patent/JPS59172722A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5180777A (enrdf_load_stackoverflow) * | 1975-01-13 | 1976-07-14 | Hitachi Ltd | |
| JPS5662324A (en) * | 1979-10-26 | 1981-05-28 | Seiko Epson Corp | Semiconductor device position fitting method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154127A (ja) * | 1984-12-27 | 1986-07-12 | Oki Electric Ind Co Ltd | ウエハ−アライメント・マ−ク |
| JPH02134808A (ja) * | 1988-11-16 | 1990-05-23 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH0377309A (ja) * | 1989-08-19 | 1991-04-02 | Fujitsu Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6347330B2 (enrdf_load_stackoverflow) | 1988-09-21 |
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