JPS59172272A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS59172272A JPS59172272A JP58045311A JP4531183A JPS59172272A JP S59172272 A JPS59172272 A JP S59172272A JP 58045311 A JP58045311 A JP 58045311A JP 4531183 A JP4531183 A JP 4531183A JP S59172272 A JPS59172272 A JP S59172272A
- Authority
- JP
- Japan
- Prior art keywords
- type
- normally
- layer
- gate
- electron gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/05—Manufacture or treatment characterised by using material-based technologies using Group III-V technology
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
Landscapes
- Junction Field-Effect Transistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58045311A JPS59172272A (ja) | 1983-03-19 | 1983-03-19 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58045311A JPS59172272A (ja) | 1983-03-19 | 1983-03-19 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59172272A true JPS59172272A (ja) | 1984-09-28 |
JPS6367342B2 JPS6367342B2 (enrdf_load_stackoverflow) | 1988-12-26 |
Family
ID=12715760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58045311A Granted JPS59172272A (ja) | 1983-03-19 | 1983-03-19 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59172272A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60145671A (ja) * | 1984-01-10 | 1985-08-01 | Nec Corp | 集積型半導体装置 |
JP2000100828A (ja) * | 1998-09-18 | 2000-04-07 | Sony Corp | 半導体装置及びその製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5439725B2 (ja) * | 2008-02-20 | 2014-03-12 | サンケン電気株式会社 | 半導体スイッチング装置 |
-
1983
- 1983-03-19 JP JP58045311A patent/JPS59172272A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60145671A (ja) * | 1984-01-10 | 1985-08-01 | Nec Corp | 集積型半導体装置 |
JP2000100828A (ja) * | 1998-09-18 | 2000-04-07 | Sony Corp | 半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6367342B2 (enrdf_load_stackoverflow) | 1988-12-26 |
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