JPS59172241A - 半導体樹脂封止装置 - Google Patents
半導体樹脂封止装置Info
- Publication number
- JPS59172241A JPS59172241A JP4565383A JP4565383A JPS59172241A JP S59172241 A JPS59172241 A JP S59172241A JP 4565383 A JP4565383 A JP 4565383A JP 4565383 A JP4565383 A JP 4565383A JP S59172241 A JPS59172241 A JP S59172241A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- tablet
- loader
- semiconductor
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/462—Injection of preformed charges of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4565383A JPS59172241A (ja) | 1983-03-18 | 1983-03-18 | 半導体樹脂封止装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4565383A JPS59172241A (ja) | 1983-03-18 | 1983-03-18 | 半導体樹脂封止装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59172241A true JPS59172241A (ja) | 1984-09-28 |
JPH056347B2 JPH056347B2 (fr) | 1993-01-26 |
Family
ID=12725331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4565383A Granted JPS59172241A (ja) | 1983-03-18 | 1983-03-18 | 半導体樹脂封止装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59172241A (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4741787A (en) * | 1985-08-28 | 1988-05-03 | Seiei Kohsan Co., Ltd. | Method and apparatus for packaging semiconductor device and the like |
US20190105817A1 (en) * | 2015-03-12 | 2019-04-11 | Toyota Jidosha Kabushiki Kaisha | Resin molding method and resin molding apparatus |
JP2022046323A (ja) * | 2020-09-10 | 2022-03-23 | アピックヤマダ株式会社 | 樹脂封止装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI793892B (zh) * | 2021-12-03 | 2023-02-21 | 日商山田尖端科技股份有限公司 | 樹脂封裝裝置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55132231A (en) * | 1979-04-04 | 1980-10-14 | Hitachi Ltd | Tablet feeder and molding machine having it |
JPS5758778A (en) * | 1980-09-26 | 1982-04-08 | Kokusan Kinzoku Kogyo Kk | Electronic lock for automobile |
-
1983
- 1983-03-18 JP JP4565383A patent/JPS59172241A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55132231A (en) * | 1979-04-04 | 1980-10-14 | Hitachi Ltd | Tablet feeder and molding machine having it |
JPS5758778A (en) * | 1980-09-26 | 1982-04-08 | Kokusan Kinzoku Kogyo Kk | Electronic lock for automobile |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4741787A (en) * | 1985-08-28 | 1988-05-03 | Seiei Kohsan Co., Ltd. | Method and apparatus for packaging semiconductor device and the like |
US20190105817A1 (en) * | 2015-03-12 | 2019-04-11 | Toyota Jidosha Kabushiki Kaisha | Resin molding method and resin molding apparatus |
US10583592B2 (en) * | 2015-03-12 | 2020-03-10 | Toyota Jidosha Kabushiki Kaisha | Resin molding method and resin molding apparatus |
JP2022046323A (ja) * | 2020-09-10 | 2022-03-23 | アピックヤマダ株式会社 | 樹脂封止装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH056347B2 (fr) | 1993-01-26 |
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