JPH0427698B2 - - Google Patents

Info

Publication number
JPH0427698B2
JPH0427698B2 JP58115372A JP11537283A JPH0427698B2 JP H0427698 B2 JPH0427698 B2 JP H0427698B2 JP 58115372 A JP58115372 A JP 58115372A JP 11537283 A JP11537283 A JP 11537283A JP H0427698 B2 JPH0427698 B2 JP H0427698B2
Authority
JP
Japan
Prior art keywords
mold
waveguide
tablet
resin
pot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58115372A
Other languages
English (en)
Japanese (ja)
Other versions
JPS607136A (ja
Inventor
Yasumasa Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP11537283A priority Critical patent/JPS607136A/ja
Publication of JPS607136A publication Critical patent/JPS607136A/ja
Publication of JPH0427698B2 publication Critical patent/JPH0427698B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP11537283A 1983-06-27 1983-06-27 半導体素子の樹脂封止装置 Granted JPS607136A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11537283A JPS607136A (ja) 1983-06-27 1983-06-27 半導体素子の樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11537283A JPS607136A (ja) 1983-06-27 1983-06-27 半導体素子の樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS607136A JPS607136A (ja) 1985-01-14
JPH0427698B2 true JPH0427698B2 (fr) 1992-05-12

Family

ID=14660894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11537283A Granted JPS607136A (ja) 1983-06-27 1983-06-27 半導体素子の樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS607136A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2259665A (en) * 1991-09-17 1993-03-24 Ford Motor Co Moulding a reinforced plastics component
GB9306268D0 (en) * 1993-03-25 1993-05-19 Ford Motor Co Resin transfer moulding
KR100733001B1 (ko) * 2006-03-29 2007-06-29 삼성광주전자 주식회사 사출장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758778A (en) * 1980-09-26 1982-04-08 Kokusan Kinzoku Kogyo Kk Electronic lock for automobile

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758778A (en) * 1980-09-26 1982-04-08 Kokusan Kinzoku Kogyo Kk Electronic lock for automobile

Also Published As

Publication number Publication date
JPS607136A (ja) 1985-01-14

Similar Documents

Publication Publication Date Title
US4554126A (en) Method for encapsulating semiconductor devices
US4599062A (en) Encapsulation molding apparatus
US4345892A (en) Injection moulding die with heavy-duty sprue bush
KR100241175B1 (ko) 돌출부가 형성된 컬-블록을 갖는 트랜스퍼 몰딩 장치
US5204122A (en) Mold for use in resin encapsulation molding
KR920009914B1 (ko) 플라스틱 패키지내의 반도체칩 내장방법
JPH0427698B2 (fr)
US4577078A (en) Apparatus for preheating mold resin for a semiconductor device
US2467440A (en) Automatic plastic molding press
US20080277825A1 (en) Method and Device for Controllable Encapsulation of Electronic Components
JPH05226396A (ja) 樹脂モールド型半導体装置の製造方法
US5175007A (en) Mold assembly with separate encapsulating cavities
JPS6355861B2 (fr)
US5556647A (en) Encapsulation mold
JPH056347B2 (fr)
JPS6355862B2 (fr)
EP1259981B1 (fr) Dispositif et procede d'encapsulation de composants electroniques montes sur un support
JPS6154636A (ja) 半導体樹脂封止用金型
US5529474A (en) System for preheating a molding compound
KR960009261Y1 (ko) 사출금형의 냉각구조
JPH04208430A (ja) 等温射出成形プ口セス
JP2709035B2 (ja) 半導体パッケージの製造方法
KR0139128Y1 (ko) 반도체패키지 제조용 몰딩프레스의 금형장치
JP2859129B2 (ja) 熱硬化性樹脂の成形方法
JPS58220715A (ja) ゴムまたは樹脂材料の射出成形方法