JPS59163893A - セラミツク配線板への部品実装構造 - Google Patents

セラミツク配線板への部品実装構造

Info

Publication number
JPS59163893A
JPS59163893A JP58037782A JP3778283A JPS59163893A JP S59163893 A JPS59163893 A JP S59163893A JP 58037782 A JP58037782 A JP 58037782A JP 3778283 A JP3778283 A JP 3778283A JP S59163893 A JPS59163893 A JP S59163893A
Authority
JP
Japan
Prior art keywords
land
terminal
lands
terminals
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58037782A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0144035B2 (en, 2012
Inventor
智之 津田
文雄 和田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58037782A priority Critical patent/JPS59163893A/ja
Publication of JPS59163893A publication Critical patent/JPS59163893A/ja
Publication of JPH0144035B2 publication Critical patent/JPH0144035B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP58037782A 1983-03-08 1983-03-08 セラミツク配線板への部品実装構造 Granted JPS59163893A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58037782A JPS59163893A (ja) 1983-03-08 1983-03-08 セラミツク配線板への部品実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58037782A JPS59163893A (ja) 1983-03-08 1983-03-08 セラミツク配線板への部品実装構造

Publications (2)

Publication Number Publication Date
JPS59163893A true JPS59163893A (ja) 1984-09-14
JPH0144035B2 JPH0144035B2 (en, 2012) 1989-09-25

Family

ID=12507054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58037782A Granted JPS59163893A (ja) 1983-03-08 1983-03-08 セラミツク配線板への部品実装構造

Country Status (1)

Country Link
JP (1) JPS59163893A (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6183080U (en, 2012) * 1984-11-07 1986-06-02
CN102853108A (zh) * 2011-06-29 2013-01-02 株式会社鹭宫制作所 钎焊结构体以及配管部件的钎焊方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527601A (en) * 1978-08-17 1980-02-27 Tokyo Shibaura Electric Co Reflow soldering pattern

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5527601A (en) * 1978-08-17 1980-02-27 Tokyo Shibaura Electric Co Reflow soldering pattern

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6183080U (en, 2012) * 1984-11-07 1986-06-02
CN102853108A (zh) * 2011-06-29 2013-01-02 株式会社鹭宫制作所 钎焊结构体以及配管部件的钎焊方法
JP2013010121A (ja) * 2011-06-29 2013-01-17 Saginomiya Seisakusho Inc ろう付構造体および配管部材のろう付方法

Also Published As

Publication number Publication date
JPH0144035B2 (en, 2012) 1989-09-25

Similar Documents

Publication Publication Date Title
JPS594873B2 (ja) 印刷配線板
JPH02198192A (ja) 表面装着型デカップリングコンデンサ
US5736680A (en) Polymorphic rectilinear thieving pad
JPH01300588A (ja) プリント配線板及びそのはんだ付け方法
JPS59163893A (ja) セラミツク配線板への部品実装構造
JPH07336030A (ja) プリント配線基板の半田ランドの構造
JPH0219635B2 (en, 2012)
JPS61171191A (ja) フレキシブルプリント配線ケ−ブル用コネクタ
JPS63124496A (ja) 多端子部品の取付方法
JP2674071B2 (ja) Lsiパッケージ
JPH04105390A (ja) 基板機構
JP3008887U (ja) Icピッチ変換基板
JP3873346B2 (ja) 配線回路基板
JP2914980B2 (ja) 多端子電子部品の表面実装構造
JPH0144034B2 (en, 2012)
JPH0414892A (ja) プリント配線基板のハンダレジスト開口部の構造
JPH03231488A (ja) プリント基板
JPH0217694A (ja) 面付電子部品実装用印刷配線基板
JPH03125468A (ja) 半導体集積回路装置の実装方法およびそれに用いる半導体集積回路装置
JP2528436B2 (ja) 回路基板装置の製造方法
JPS63177581A (ja) プリント配線パタ−ン
JPS582091A (ja) 印刷配線基板
JPS604288A (ja) プリント板配線方法
JPH05129767A (ja) プリント配線基板
JPH04267581A (ja) プリント基板