JPS59163893A - セラミツク配線板への部品実装構造 - Google Patents
セラミツク配線板への部品実装構造Info
- Publication number
- JPS59163893A JPS59163893A JP58037782A JP3778283A JPS59163893A JP S59163893 A JPS59163893 A JP S59163893A JP 58037782 A JP58037782 A JP 58037782A JP 3778283 A JP3778283 A JP 3778283A JP S59163893 A JPS59163893 A JP S59163893A
- Authority
- JP
- Japan
- Prior art keywords
- land
- terminal
- lands
- terminals
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58037782A JPS59163893A (ja) | 1983-03-08 | 1983-03-08 | セラミツク配線板への部品実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58037782A JPS59163893A (ja) | 1983-03-08 | 1983-03-08 | セラミツク配線板への部品実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59163893A true JPS59163893A (ja) | 1984-09-14 |
| JPH0144035B2 JPH0144035B2 (enrdf_load_stackoverflow) | 1989-09-25 |
Family
ID=12507054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58037782A Granted JPS59163893A (ja) | 1983-03-08 | 1983-03-08 | セラミツク配線板への部品実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59163893A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6183080U (enrdf_load_stackoverflow) * | 1984-11-07 | 1986-06-02 | ||
| CN102853108A (zh) * | 2011-06-29 | 2013-01-02 | 株式会社鹭宫制作所 | 钎焊结构体以及配管部件的钎焊方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527601A (en) * | 1978-08-17 | 1980-02-27 | Tokyo Shibaura Electric Co | Reflow soldering pattern |
-
1983
- 1983-03-08 JP JP58037782A patent/JPS59163893A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527601A (en) * | 1978-08-17 | 1980-02-27 | Tokyo Shibaura Electric Co | Reflow soldering pattern |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6183080U (enrdf_load_stackoverflow) * | 1984-11-07 | 1986-06-02 | ||
| CN102853108A (zh) * | 2011-06-29 | 2013-01-02 | 株式会社鹭宫制作所 | 钎焊结构体以及配管部件的钎焊方法 |
| JP2013010121A (ja) * | 2011-06-29 | 2013-01-17 | Saginomiya Seisakusho Inc | ろう付構造体および配管部材のろう付方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0144035B2 (enrdf_load_stackoverflow) | 1989-09-25 |
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