JPS59163889A - 基板上導体への部分的めつき形成方法 - Google Patents

基板上導体への部分的めつき形成方法

Info

Publication number
JPS59163889A
JPS59163889A JP58037653A JP3765383A JPS59163889A JP S59163889 A JPS59163889 A JP S59163889A JP 58037653 A JP58037653 A JP 58037653A JP 3765383 A JP3765383 A JP 3765383A JP S59163889 A JPS59163889 A JP S59163889A
Authority
JP
Japan
Prior art keywords
conductor
substrate
plating
plating layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58037653A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0244157B2 (enExample
Inventor
瑛一 綱島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58037653A priority Critical patent/JPS59163889A/ja
Publication of JPS59163889A publication Critical patent/JPS59163889A/ja
Publication of JPH0244157B2 publication Critical patent/JPH0244157B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58037653A 1983-03-08 1983-03-08 基板上導体への部分的めつき形成方法 Granted JPS59163889A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58037653A JPS59163889A (ja) 1983-03-08 1983-03-08 基板上導体への部分的めつき形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58037653A JPS59163889A (ja) 1983-03-08 1983-03-08 基板上導体への部分的めつき形成方法

Publications (2)

Publication Number Publication Date
JPS59163889A true JPS59163889A (ja) 1984-09-14
JPH0244157B2 JPH0244157B2 (enExample) 1990-10-02

Family

ID=12503601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58037653A Granted JPS59163889A (ja) 1983-03-08 1983-03-08 基板上導体への部分的めつき形成方法

Country Status (1)

Country Link
JP (1) JPS59163889A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639997A (ja) * 1986-06-30 1988-01-16 イビデン株式会社 表面実装用プリント配線板
JPWO2014103541A1 (ja) * 2012-12-27 2017-01-12 日本碍子株式会社 電子部品及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5369757U (enExample) * 1976-11-15 1978-06-12
JPS55104496A (en) * 1979-01-29 1980-08-09 Matsushita Electric Ind Co Ltd Partial plating method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5369757U (enExample) * 1976-11-15 1978-06-12
JPS55104496A (en) * 1979-01-29 1980-08-09 Matsushita Electric Ind Co Ltd Partial plating method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639997A (ja) * 1986-06-30 1988-01-16 イビデン株式会社 表面実装用プリント配線板
JPWO2014103541A1 (ja) * 2012-12-27 2017-01-12 日本碍子株式会社 電子部品及びその製造方法

Also Published As

Publication number Publication date
JPH0244157B2 (enExample) 1990-10-02

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