JPS59161809A - リ−ドフレ−ム搬送装置 - Google Patents
リ−ドフレ−ム搬送装置Info
- Publication number
- JPS59161809A JPS59161809A JP58037163A JP3716383A JPS59161809A JP S59161809 A JPS59161809 A JP S59161809A JP 58037163 A JP58037163 A JP 58037163A JP 3716383 A JP3716383 A JP 3716383A JP S59161809 A JPS59161809 A JP S59161809A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- frames
- rail
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011295 pitch Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 abstract description 2
- 230000007246 mechanism Effects 0.000 description 12
- 230000032258 transport Effects 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 4
- 239000004575 stone Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- UNPLRYRWJLTVAE-UHFFFAOYSA-N Cloperastine hydrochloride Chemical compound Cl.C1=CC(Cl)=CC=C1C(C=1C=CC=CC=1)OCCN1CCCCC1 UNPLRYRWJLTVAE-UHFFFAOYSA-N 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Attitude Control For Articles On Conveyors (AREA)
- Wire Bonding (AREA)
- Control Of Conveyors (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58037163A JPS59161809A (ja) | 1983-03-07 | 1983-03-07 | リ−ドフレ−ム搬送装置 |
| US06/586,696 US4624358A (en) | 1983-03-07 | 1984-03-06 | Device for transferring lead frame |
| DE3408368A DE3408368C2 (de) | 1983-03-07 | 1984-03-07 | Fördervorrichtung für geführte Rahmen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58037163A JPS59161809A (ja) | 1983-03-07 | 1983-03-07 | リ−ドフレ−ム搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59161809A true JPS59161809A (ja) | 1984-09-12 |
| JPH0412618B2 JPH0412618B2 (enrdf_load_stackoverflow) | 1992-03-05 |
Family
ID=12489925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58037163A Granted JPS59161809A (ja) | 1983-03-07 | 1983-03-07 | リ−ドフレ−ム搬送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59161809A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300585A (ja) * | 2007-05-31 | 2008-12-11 | Hitachi High-Tech Instruments Co Ltd | 半導体素子の装着装置 |
| JP2010010465A (ja) * | 2008-06-27 | 2010-01-14 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
-
1983
- 1983-03-07 JP JP58037163A patent/JPS59161809A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300585A (ja) * | 2007-05-31 | 2008-12-11 | Hitachi High-Tech Instruments Co Ltd | 半導体素子の装着装置 |
| JP2010010465A (ja) * | 2008-06-27 | 2010-01-14 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412618B2 (enrdf_load_stackoverflow) | 1992-03-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59161809A (ja) | リ−ドフレ−ム搬送装置 | |
| JP2579850B2 (ja) | Ｎｃランニングソー装置 | |
| JPH0473293B2 (enrdf_load_stackoverflow) | ||
| JPS59181542A (ja) | リ−ドフレ−ム搬送装置 | |
| JPS61188035A (ja) | プリント基板の面取り装置 | |
| JPH06206201A (ja) | ランニングソーシステム | |
| JPS5986250A (ja) | 半導体製造装置 | |
| JPS62122224A (ja) | フレ−ムフイ−ダ− | |
| JPS6274556A (ja) | 自動搬送装置 | |
| KR100203815B1 (ko) | 파이프형 소재의 피드 백 로더 | |
| JP2784684B2 (ja) | 物品の輸送供給装置 | |
| JP3144696B2 (ja) | リードフレームの加工機 | |
| KR950010669B1 (ko) | 런닝 톱(running saw) 시스템 | |
| JP2575510B2 (ja) | 板状体用自動穿孔装置 | |
| JPH01145144A (ja) | 液状フォトレジスト塗布用自動印刷機 | |
| JP2850991B2 (ja) | 長尺材の定寸鋸断方法 | |
| JP2664951B2 (ja) | 半導体製造装置 | |
| DE112023001376T5 (de) | Wafer-Bearbeitungsvorrichtung, Halbleiterchip-Herstellungsverfahren und Halbleiterchip | |
| JPH0325894Y2 (enrdf_load_stackoverflow) | ||
| JPH0340527Y2 (enrdf_load_stackoverflow) | ||
| KR940007178Y1 (ko) | 레이저 마킹장치 | |
| JPH044931A (ja) | 印刷配線基板用自動プレス装置 | |
| KR100256221B1 (ko) | 반도체 패키지 제조용 마킹장비의 자재 이송장치 | |
| JPH0737907A (ja) | 半導体処理装置およびその処理方法 | |
| JPH02192833A (ja) | プレート材の送り装置 |