JPS59155161A - 半導体素子のボンデイング用ワイヤ - Google Patents

半導体素子のボンデイング用ワイヤ

Info

Publication number
JPS59155161A
JPS59155161A JP58030041A JP3004183A JPS59155161A JP S59155161 A JPS59155161 A JP S59155161A JP 58030041 A JP58030041 A JP 58030041A JP 3004183 A JP3004183 A JP 3004183A JP S59155161 A JPS59155161 A JP S59155161A
Authority
JP
Japan
Prior art keywords
wire
bonding
gold
copper
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58030041A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0213814B2 (enExample
Inventor
Yoichi Yorita
寄田　洋一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAIICHI DENKO KK
Original Assignee
DAIICHI DENKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAIICHI DENKO KK filed Critical DAIICHI DENKO KK
Priority to JP58030041A priority Critical patent/JPS59155161A/ja
Publication of JPS59155161A publication Critical patent/JPS59155161A/ja
Publication of JPH0213814B2 publication Critical patent/JPH0213814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/555—Materials of bond wires of outermost layers of multilayered bond wires, e.g. material of a coating

Landscapes

  • Wire Bonding (AREA)
JP58030041A 1983-02-23 1983-02-23 半導体素子のボンデイング用ワイヤ Granted JPS59155161A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58030041A JPS59155161A (ja) 1983-02-23 1983-02-23 半導体素子のボンデイング用ワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58030041A JPS59155161A (ja) 1983-02-23 1983-02-23 半導体素子のボンデイング用ワイヤ

Publications (2)

Publication Number Publication Date
JPS59155161A true JPS59155161A (ja) 1984-09-04
JPH0213814B2 JPH0213814B2 (enExample) 1990-04-05

Family

ID=12292732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58030041A Granted JPS59155161A (ja) 1983-02-23 1983-02-23 半導体素子のボンデイング用ワイヤ

Country Status (1)

Country Link
JP (1) JPS59155161A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2563381A1 (fr) * 1984-04-19 1985-10-25 Hitachi Ltd Raccordement electrique des pastilles et des elements de cablage d'un dispositif a semi-conducteurs a un fil de cuivre
JPH0332033A (ja) * 1989-06-29 1991-02-12 Hitachi Ltd 電子装置
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc ELECTRICAL CONTACT STRUCTURE MADE OF FLEXIBLE WIRE
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
EP1279491A1 (en) * 2001-07-23 2003-01-29 Tao-Kuang Chang Gold wire for use in semiconductor packaging and high-frequency signal transmission and its fabrication method
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
CN100352026C (zh) * 2002-11-27 2007-11-28 新日本制铁株式会社 半导体器件的金连接线及其生产方法
US7390370B2 (en) 2002-04-05 2008-06-24 Nippon Steel Corporation Gold bonding wires for semiconductor devices and method of producing the wires
JP2008533707A (ja) * 2005-03-08 2008-08-21 ヴェー ツェー ヘレーウス ゲゼルシャフト ミット ベシュレンクテル ハフツング 改善されたボンディング特性および腐食特性を有する銅ボンディングワイヤまたは超極細ワイヤ
WO2011013527A1 (ja) 2009-07-30 2011-02-03 新日鉄マテリアルズ株式会社 半導体用ボンディングワイヤー
US7969021B2 (en) 2000-09-18 2011-06-28 Nippon Steel Corporation Bonding wire for semiconductor device and method for producing the same
CN103219248A (zh) * 2013-03-01 2013-07-24 溧阳市虹翔机械制造有限公司 一种镀金键合铜丝的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006025870A1 (de) 2006-06-02 2007-12-06 Robert Bosch Gmbh Mehrschichtiges Bond-Bändchen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712543A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Semiconductor device
JPS5829835U (ja) * 1981-08-20 1983-02-26 沖電線株式会社 半導体集積回路用ボンデイングワイヤ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712543A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Semiconductor device
JPS5829835U (ja) * 1981-08-20 1983-02-26 沖電線株式会社 半導体集積回路用ボンデイングワイヤ

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2563381A1 (fr) * 1984-04-19 1985-10-25 Hitachi Ltd Raccordement electrique des pastilles et des elements de cablage d'un dispositif a semi-conducteurs a un fil de cuivre
JPH0332033A (ja) * 1989-06-29 1991-02-12 Hitachi Ltd 電子装置
US6336269B1 (en) * 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US6778406B2 (en) 1993-11-16 2004-08-17 Formfactor, Inc. Resilient contact structures for interconnecting electronic devices
US6835898B2 (en) 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
EP0792517A4 (en) * 1994-11-15 1998-06-24 Formfactor Inc ELECTRICAL CONTACT STRUCTURE MADE OF FLEXIBLE WIRE
US6727579B1 (en) 1994-11-16 2004-04-27 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US7969021B2 (en) 2000-09-18 2011-06-28 Nippon Steel Corporation Bonding wire for semiconductor device and method for producing the same
EP1279491A1 (en) * 2001-07-23 2003-01-29 Tao-Kuang Chang Gold wire for use in semiconductor packaging and high-frequency signal transmission and its fabrication method
US7390370B2 (en) 2002-04-05 2008-06-24 Nippon Steel Corporation Gold bonding wires for semiconductor devices and method of producing the wires
CN100352026C (zh) * 2002-11-27 2007-11-28 新日本制铁株式会社 半导体器件的金连接线及其生产方法
JP2008533707A (ja) * 2005-03-08 2008-08-21 ヴェー ツェー ヘレーウス ゲゼルシャフト ミット ベシュレンクテル ハフツング 改善されたボンディング特性および腐食特性を有する銅ボンディングワイヤまたは超極細ワイヤ
WO2011013527A1 (ja) 2009-07-30 2011-02-03 新日鉄マテリアルズ株式会社 半導体用ボンディングワイヤー
KR20120035093A (ko) 2009-07-30 2012-04-13 가부시키가이샤 닛데쓰 마이크로 메탈 반도체용 본딩 와이어
US8742258B2 (en) 2009-07-30 2014-06-03 Nippon Steel & Sumikin Materials Co., Ltd. Bonding wire for semiconductor
CN103219248A (zh) * 2013-03-01 2013-07-24 溧阳市虹翔机械制造有限公司 一种镀金键合铜丝的制造方法

Also Published As

Publication number Publication date
JPH0213814B2 (enExample) 1990-04-05

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