JPS59141258A - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS59141258A
JPS59141258A JP58016576A JP1657683A JPS59141258A JP S59141258 A JPS59141258 A JP S59141258A JP 58016576 A JP58016576 A JP 58016576A JP 1657683 A JP1657683 A JP 1657683A JP S59141258 A JPS59141258 A JP S59141258A
Authority
JP
Japan
Prior art keywords
insulating film
substrate
shape
bent
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58016576A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0359591B2 (cg-RX-API-DMAC10.html
Inventor
Akira Kazami
風見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP58016576A priority Critical patent/JPS59141258A/ja
Publication of JPS59141258A publication Critical patent/JPS59141258A/ja
Publication of JPH0359591B2 publication Critical patent/JPH0359591B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H10W72/5449—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP58016576A 1983-02-02 1983-02-02 混成集積回路 Granted JPS59141258A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58016576A JPS59141258A (ja) 1983-02-02 1983-02-02 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58016576A JPS59141258A (ja) 1983-02-02 1983-02-02 混成集積回路

Publications (2)

Publication Number Publication Date
JPS59141258A true JPS59141258A (ja) 1984-08-13
JPH0359591B2 JPH0359591B2 (cg-RX-API-DMAC10.html) 1991-09-11

Family

ID=11920114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58016576A Granted JPS59141258A (ja) 1983-02-02 1983-02-02 混成集積回路

Country Status (1)

Country Link
JP (1) JPS59141258A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207041U (cg-RX-API-DMAC10.html) * 1985-06-14 1986-12-27
FR2714250A1 (fr) * 1993-12-21 1995-06-23 Siemens Automotive Sa Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5082662U (cg-RX-API-DMAC10.html) * 1973-12-03 1975-07-16
JPS5795691A (en) * 1980-12-08 1982-06-14 Matsushita Electric Industrial Co Ltd Compact electronic circuit and method of producing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5082662U (cg-RX-API-DMAC10.html) * 1973-12-03 1975-07-16
JPS5795691A (en) * 1980-12-08 1982-06-14 Matsushita Electric Industrial Co Ltd Compact electronic circuit and method of producing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207041U (cg-RX-API-DMAC10.html) * 1985-06-14 1986-12-27
FR2714250A1 (fr) * 1993-12-21 1995-06-23 Siemens Automotive Sa Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support.

Also Published As

Publication number Publication date
JPH0359591B2 (cg-RX-API-DMAC10.html) 1991-09-11

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