JPH0359591B2 - - Google Patents

Info

Publication number
JPH0359591B2
JPH0359591B2 JP58016576A JP1657683A JPH0359591B2 JP H0359591 B2 JPH0359591 B2 JP H0359591B2 JP 58016576 A JP58016576 A JP 58016576A JP 1657683 A JP1657683 A JP 1657683A JP H0359591 B2 JPH0359591 B2 JP H0359591B2
Authority
JP
Japan
Prior art keywords
insulating film
integrated circuit
conductive path
substrate
connecting body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58016576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59141258A (ja
Inventor
Akira Kazami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP58016576A priority Critical patent/JPS59141258A/ja
Publication of JPS59141258A publication Critical patent/JPS59141258A/ja
Publication of JPH0359591B2 publication Critical patent/JPH0359591B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H10W72/5449—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP58016576A 1983-02-02 1983-02-02 混成集積回路 Granted JPS59141258A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58016576A JPS59141258A (ja) 1983-02-02 1983-02-02 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58016576A JPS59141258A (ja) 1983-02-02 1983-02-02 混成集積回路

Publications (2)

Publication Number Publication Date
JPS59141258A JPS59141258A (ja) 1984-08-13
JPH0359591B2 true JPH0359591B2 (cg-RX-API-DMAC10.html) 1991-09-11

Family

ID=11920114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58016576A Granted JPS59141258A (ja) 1983-02-02 1983-02-02 混成集積回路

Country Status (1)

Country Link
JP (1) JPS59141258A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207041U (cg-RX-API-DMAC10.html) * 1985-06-14 1986-12-27
FR2714250B1 (fr) * 1993-12-21 1996-01-19 Siemens Automotive Sa Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5082662U (cg-RX-API-DMAC10.html) * 1973-12-03 1975-07-16
JPS5795691A (en) * 1980-12-08 1982-06-14 Matsushita Electric Industrial Co Ltd Compact electronic circuit and method of producing same

Also Published As

Publication number Publication date
JPS59141258A (ja) 1984-08-13

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