FR2714250B1 - Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support. - Google Patents

Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support.

Info

Publication number
FR2714250B1
FR2714250B1 FR9315618A FR9315618A FR2714250B1 FR 2714250 B1 FR2714250 B1 FR 2714250B1 FR 9315618 A FR9315618 A FR 9315618A FR 9315618 A FR9315618 A FR 9315618A FR 2714250 B1 FR2714250 B1 FR 2714250B1
Authority
FR
France
Prior art keywords
support
folding
printed circuit
flexible printed
electronic box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9315618A
Other languages
English (en)
Other versions
FR2714250A1 (fr
Inventor
Bonhomme Guy
Hellemans Roel
Vidal Alain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive France SAS
Original Assignee
Siemens Automotive SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Automotive SA filed Critical Siemens Automotive SA
Priority to FR9315618A priority Critical patent/FR2714250B1/fr
Publication of FR2714250A1 publication Critical patent/FR2714250A1/fr
Application granted granted Critical
Publication of FR2714250B1 publication Critical patent/FR2714250B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
FR9315618A 1993-12-21 1993-12-21 Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support. Expired - Fee Related FR2714250B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9315618A FR2714250B1 (fr) 1993-12-21 1993-12-21 Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9315618A FR2714250B1 (fr) 1993-12-21 1993-12-21 Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support.

Publications (2)

Publication Number Publication Date
FR2714250A1 FR2714250A1 (fr) 1995-06-23
FR2714250B1 true FR2714250B1 (fr) 1996-01-19

Family

ID=9454373

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9315618A Expired - Fee Related FR2714250B1 (fr) 1993-12-21 1993-12-21 Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support.

Country Status (1)

Country Link
FR (1) FR2714250B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20108532U1 (de) * 2001-05-21 2001-09-13 Coroplast Fritz Mueller Gmbh Folienleiter, wie Folienleiterkabel oder -platte
DE10221553A1 (de) * 2002-05-14 2003-11-27 Rotra Leiterplatten Produktion Mehrlagen-Leiterplatten-Verbundkörper sowie Verfahren zu dessen Herstellung
US7075794B2 (en) * 2003-09-11 2006-07-11 Motorola, Inc. Electronic control unit
DE102004046251B4 (de) * 2004-04-19 2008-08-21 Lenze Drive Systems Gmbh Verfahren zur biegenden Herstellung eines Geräts der Leistungselektronik

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59141258A (ja) * 1983-02-02 1984-08-13 Sanyo Electric Co Ltd 混成集積回路
US5265322A (en) * 1990-02-05 1993-11-30 Motorola, Inc. Electronic module assembly and method of forming same
US5103375A (en) * 1990-02-05 1992-04-07 Motorola, Inc. Electronic module assembly and method of manufacture
US5179501A (en) * 1992-02-24 1993-01-12 Motorola, Inc. Laminated electronic module assembly

Also Published As

Publication number Publication date
FR2714250A1 (fr) 1995-06-23

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Legal Events

Date Code Title Description
ST Notification of lapse
CA Change of address
CD Change of name or company name
CJ Change in legal form