JPS59136950A - バンプ型電極の形成方法 - Google Patents
バンプ型電極の形成方法Info
- Publication number
- JPS59136950A JPS59136950A JP58011820A JP1182083A JPS59136950A JP S59136950 A JPS59136950 A JP S59136950A JP 58011820 A JP58011820 A JP 58011820A JP 1182083 A JP1182083 A JP 1182083A JP S59136950 A JPS59136950 A JP S59136950A
- Authority
- JP
- Japan
- Prior art keywords
- bump
- current density
- stages
- electrode
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000009713 electroplating Methods 0.000 claims abstract description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 230000001681 protective effect Effects 0.000 abstract description 5
- 230000004888 barrier function Effects 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 241000270666 Testudines Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58011820A JPS59136950A (ja) | 1983-01-27 | 1983-01-27 | バンプ型電極の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58011820A JPS59136950A (ja) | 1983-01-27 | 1983-01-27 | バンプ型電極の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59136950A true JPS59136950A (ja) | 1984-08-06 |
| JPH0454374B2 JPH0454374B2 (enrdf_load_stackoverflow) | 1992-08-31 |
Family
ID=11788418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58011820A Granted JPS59136950A (ja) | 1983-01-27 | 1983-01-27 | バンプ型電極の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59136950A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62154648A (ja) * | 1985-12-26 | 1987-07-09 | Toshiba Corp | バンプ形成方法 |
| JP2007100130A (ja) * | 2005-09-30 | 2007-04-19 | Ne Chemcat Corp | 金バンプ又は金配線の形成方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5773953A (en) * | 1980-10-25 | 1982-05-08 | Nec Home Electronics Ltd | Production of semiconductor device |
-
1983
- 1983-01-27 JP JP58011820A patent/JPS59136950A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5773953A (en) * | 1980-10-25 | 1982-05-08 | Nec Home Electronics Ltd | Production of semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62154648A (ja) * | 1985-12-26 | 1987-07-09 | Toshiba Corp | バンプ形成方法 |
| JP2007100130A (ja) * | 2005-09-30 | 2007-04-19 | Ne Chemcat Corp | 金バンプ又は金配線の形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0454374B2 (enrdf_load_stackoverflow) | 1992-08-31 |
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