JPS59129252A - エポキシ樹脂成形材料 - Google Patents
エポキシ樹脂成形材料Info
- Publication number
- JPS59129252A JPS59129252A JP439183A JP439183A JPS59129252A JP S59129252 A JPS59129252 A JP S59129252A JP 439183 A JP439183 A JP 439183A JP 439183 A JP439183 A JP 439183A JP S59129252 A JPS59129252 A JP S59129252A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- silicone intermediate
- resin molding
- added
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 26
- 239000012778 molding material Substances 0.000 title claims abstract description 15
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 19
- 229920003986 novolac Polymers 0.000 claims abstract description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 10
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 229930185605 Bisphenol Natural products 0.000 abstract description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000049 pigment Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- 239000012744 reinforcing agent Substances 0.000 abstract 1
- 239000000543 intermediate Substances 0.000 description 12
- 230000007423 decrease Effects 0.000 description 8
- 230000035882 stress Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- -1 amino modified silicon Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP439183A JPS59129252A (ja) | 1983-01-14 | 1983-01-14 | エポキシ樹脂成形材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP439183A JPS59129252A (ja) | 1983-01-14 | 1983-01-14 | エポキシ樹脂成形材料 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2079819A Division JPH0660233B2 (ja) | 1990-03-27 | 1990-03-27 | エポキシ樹脂成形材料の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59129252A true JPS59129252A (ja) | 1984-07-25 |
| JPS6315295B2 JPS6315295B2 (enExample) | 1988-04-04 |
Family
ID=11583050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP439183A Granted JPS59129252A (ja) | 1983-01-14 | 1983-01-14 | エポキシ樹脂成形材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59129252A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0218228A2 (en) | 1985-10-07 | 1987-04-15 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
| JPS62128162A (ja) * | 1985-11-28 | 1987-06-10 | Nitto Electric Ind Co Ltd | 半導体装置 |
| JPS62158716A (ja) * | 1985-12-30 | 1987-07-14 | ダウ コ−ニング コ−ポレ−シヨン | シリコ−ン変性剤分散体および変性方法 |
| US5006614A (en) * | 1988-07-05 | 1991-04-09 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5131799A (ja) * | 1974-09-13 | 1976-03-18 | Hitachi Ltd | Netsukokaseijushisoseibutsu |
| JPS5160299A (ja) * | 1974-11-25 | 1976-05-26 | Sumitomo Bakelite Co | Ehokishijushokokazaisoseibutsu |
| JPS51111299A (en) * | 1975-02-28 | 1976-10-01 | Ciba Geigy Ag | Setting mixture and process for producing same |
| JPS56136816A (en) * | 1980-03-31 | 1981-10-26 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS57184242A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Molding material for sealing electronic part |
| JPS5821417A (ja) * | 1981-07-29 | 1983-02-08 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
| JPS5869244A (ja) * | 1981-10-21 | 1983-04-25 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
-
1983
- 1983-01-14 JP JP439183A patent/JPS59129252A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5131799A (ja) * | 1974-09-13 | 1976-03-18 | Hitachi Ltd | Netsukokaseijushisoseibutsu |
| JPS5160299A (ja) * | 1974-11-25 | 1976-05-26 | Sumitomo Bakelite Co | Ehokishijushokokazaisoseibutsu |
| JPS51111299A (en) * | 1975-02-28 | 1976-10-01 | Ciba Geigy Ag | Setting mixture and process for producing same |
| JPS56136816A (en) * | 1980-03-31 | 1981-10-26 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS57184242A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Molding material for sealing electronic part |
| JPS5821417A (ja) * | 1981-07-29 | 1983-02-08 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
| JPS5869244A (ja) * | 1981-10-21 | 1983-04-25 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0218228A2 (en) | 1985-10-07 | 1987-04-15 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
| US4877822A (en) * | 1985-10-07 | 1989-10-31 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
| US5053445A (en) * | 1985-10-07 | 1991-10-01 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
| EP0218228B1 (en) * | 1985-10-07 | 1993-09-15 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition |
| JPS62128162A (ja) * | 1985-11-28 | 1987-06-10 | Nitto Electric Ind Co Ltd | 半導体装置 |
| JPS62158716A (ja) * | 1985-12-30 | 1987-07-14 | ダウ コ−ニング コ−ポレ−シヨン | シリコ−ン変性剤分散体および変性方法 |
| US5006614A (en) * | 1988-07-05 | 1991-04-09 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device encapsulated therewith containing polymaleimide and (allyl-epoxy)novolac/siloxane graft copolymer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6315295B2 (enExample) | 1988-04-04 |
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