JPH0588847B2 - - Google Patents

Info

Publication number
JPH0588847B2
JPH0588847B2 JP61103812A JP10381286A JPH0588847B2 JP H0588847 B2 JPH0588847 B2 JP H0588847B2 JP 61103812 A JP61103812 A JP 61103812A JP 10381286 A JP10381286 A JP 10381286A JP H0588847 B2 JPH0588847 B2 JP H0588847B2
Authority
JP
Japan
Prior art keywords
epoxy resin
silicone oil
butyl
methyl
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP61103812A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62260817A (ja
Inventor
Tomohito Ootsuki
Shinichi Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP61103812A priority Critical patent/JPS62260817A/ja
Publication of JPS62260817A publication Critical patent/JPS62260817A/ja
Publication of JPH0588847B2 publication Critical patent/JPH0588847B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/476—

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP61103812A 1986-05-08 1986-05-08 エポキシ樹脂組成物 Granted JPS62260817A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61103812A JPS62260817A (ja) 1986-05-08 1986-05-08 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61103812A JPS62260817A (ja) 1986-05-08 1986-05-08 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS62260817A JPS62260817A (ja) 1987-11-13
JPH0588847B2 true JPH0588847B2 (enExample) 1993-12-24

Family

ID=14363813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61103812A Granted JPS62260817A (ja) 1986-05-08 1986-05-08 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS62260817A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317927A (ja) * 1986-07-09 1988-01-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS6317928A (ja) * 1986-07-10 1988-01-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP2587043B2 (ja) * 1986-12-26 1997-03-05 日東電工株式会社 半導体装置
JPH0737510B2 (ja) * 1988-07-09 1995-04-26 サンスター技研株式会社 シリコーン樹脂粒子の分散安定剤
CA2030959A1 (en) * 1989-11-30 1991-05-31 Tadashi Fuji Curable epoxy resin compositions
KR960005064B1 (ko) * 1991-09-26 1996-04-20 제일모직주식회사 신규한 이미드-에폭시수지와 그 제조방법
JPH0794535B2 (ja) * 1991-11-30 1995-10-11 第一毛織株式会社 半導体素子密封用エポキシ樹脂組成物
KR960010845B1 (ko) * 1992-01-18 1996-08-09 제일모직 주식회사 반도체소자 밀봉용 에폭시수지 조성물
JP2703733B2 (ja) * 1995-03-16 1998-01-26 日東電工株式会社 半導体装置

Also Published As

Publication number Publication date
JPS62260817A (ja) 1987-11-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees