JPS62260817A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS62260817A
JPS62260817A JP61103812A JP10381286A JPS62260817A JP S62260817 A JPS62260817 A JP S62260817A JP 61103812 A JP61103812 A JP 61103812A JP 10381286 A JP10381286 A JP 10381286A JP S62260817 A JPS62260817 A JP S62260817A
Authority
JP
Japan
Prior art keywords
epoxy resin
silicone oil
resin composition
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61103812A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0588847B2 (enExample
Inventor
Tomohito Ootsuki
大槻　智仁
Shinichi Tanimoto
谷本　信一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP61103812A priority Critical patent/JPS62260817A/ja
Publication of JPS62260817A publication Critical patent/JPS62260817A/ja
Publication of JPH0588847B2 publication Critical patent/JPH0588847B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/476—

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP61103812A 1986-05-08 1986-05-08 エポキシ樹脂組成物 Granted JPS62260817A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61103812A JPS62260817A (ja) 1986-05-08 1986-05-08 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61103812A JPS62260817A (ja) 1986-05-08 1986-05-08 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS62260817A true JPS62260817A (ja) 1987-11-13
JPH0588847B2 JPH0588847B2 (enExample) 1993-12-24

Family

ID=14363813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61103812A Granted JPS62260817A (ja) 1986-05-08 1986-05-08 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS62260817A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317928A (ja) * 1986-07-10 1988-01-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS6317927A (ja) * 1986-07-09 1988-01-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS63164451A (ja) * 1986-12-26 1988-07-07 Nitto Electric Ind Co Ltd 半導体装置
JPH01268721A (ja) * 1988-07-09 1989-10-26 Sunstar Eng Inc シリコーン樹脂粒子の分散安定剤
EP0430254A3 (en) * 1989-11-30 1992-07-08 Dow Corning Toray Silicone Company, Limited Curable epoxy resin compositions
US5189082A (en) * 1991-09-26 1993-02-23 Cheil Industries, Inc. Imide epoxy resins for sealing semiconductor elements
US5254605A (en) * 1991-11-30 1993-10-19 Cheil Industries, Inc. Imide epoxy resin composition for sealing semiconductor elements
US5266612A (en) * 1992-01-18 1993-11-30 Cheil Industries, Inc. Imide epoxy resin composition for sealing semiconductor elements
JPH0885718A (ja) * 1995-03-16 1996-04-02 Nitto Denko Corp 半導体装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317927A (ja) * 1986-07-09 1988-01-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS6317928A (ja) * 1986-07-10 1988-01-25 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS63164451A (ja) * 1986-12-26 1988-07-07 Nitto Electric Ind Co Ltd 半導体装置
JPH01268721A (ja) * 1988-07-09 1989-10-26 Sunstar Eng Inc シリコーン樹脂粒子の分散安定剤
EP0430254A3 (en) * 1989-11-30 1992-07-08 Dow Corning Toray Silicone Company, Limited Curable epoxy resin compositions
US5189082A (en) * 1991-09-26 1993-02-23 Cheil Industries, Inc. Imide epoxy resins for sealing semiconductor elements
US5254605A (en) * 1991-11-30 1993-10-19 Cheil Industries, Inc. Imide epoxy resin composition for sealing semiconductor elements
US5266612A (en) * 1992-01-18 1993-11-30 Cheil Industries, Inc. Imide epoxy resin composition for sealing semiconductor elements
JPH0885718A (ja) * 1995-03-16 1996-04-02 Nitto Denko Corp 半導体装置

Also Published As

Publication number Publication date
JPH0588847B2 (enExample) 1993-12-24

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Legal Events

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LAPS Cancellation because of no payment of annual fees