JPS59117280A - 半導体発光装置 - Google Patents

半導体発光装置

Info

Publication number
JPS59117280A
JPS59117280A JP57230881A JP23088182A JPS59117280A JP S59117280 A JPS59117280 A JP S59117280A JP 57230881 A JP57230881 A JP 57230881A JP 23088182 A JP23088182 A JP 23088182A JP S59117280 A JPS59117280 A JP S59117280A
Authority
JP
Japan
Prior art keywords
light emitting
bonding
light
emitting device
emitting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57230881A
Other languages
English (en)
Inventor
Yojiro Kamei
洋次郎 亀井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP57230881A priority Critical patent/JPS59117280A/ja
Publication of JPS59117280A publication Critical patent/JPS59117280A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔技術分野〕 本発明は発光素子アレイを有する半導体発光装置に関し
、特にトリミング手段に改良を加えた発光装置に関する
。
〔従来技術〕
発光素子アレイを有する発光装置において５．各発光部
の発光出力全調整するには、従来個別電極側に抵抗体を
形成し、ワイヤボンディングを行なう前筐たは後に抵抗
体をレーザでトリミングしていた。しかるに、この方法
では、レーザトリミングという工程が別個に必要なため
、製造に要する時間が長く、また歩留りが低いという問
題があった。また、レーザトリマー自体も高価であり、
これらのため発光装置の製造コストが高くなるという問
題があった。
〔目的〕
本発明の目的はトリミング（光量調整）が容易な発光装
置を提供することにある。
〔構成〕
以下、不発明の構成を、実施例に基いて説明する。
第を図および第２図は本発明の一実施例を示したもので
ある。図示のように、基板［上の共通電極２に、半導体
発光素子アレイ３を構成する半導体結晶体４がダイボン
ディングされている。このアレイ３は複数の発光部５を
有するもので、各発光部５に対して、発光窓６とコンタ
クト１極７とが設けられている。
基板【上には、さらに、アレイ３に隣接する位置に、各
発光部５に対応して帯状の抵抗体８が形成されτいる。
抵抗体８は、図示のように、アレイ３の延びる方向に直
角な方向に延びるように配向され、アレイ３から遠い側
の端部８ａが個別電極を形成している。抵抗体８は例え
ばＮｉ−０ｒ。
Ｔａ−Ｎ等で形成される。
各抵抗体８の上には、図示のように、秒数のポンディン
グパッド９ａ〜９ｄが設けられているこのポンディング
パッド例えばフォトリソグラフィーとメッキとにより形
成される。
各発光部については、ボンディング以前に、プローバー
を用いて、あるいはフオトルミネセン７の測定によシ、
電気的特性、発売特性を測定しておく。そして、このデ
ータに基いて、同一電圧で駆動した時に、各発光部の発
光の明るさが同一になるように、各発光部に対応する抵
抗体のポンディングパッド９ａ〜９ｄを選択し、ゾロ択
されたバッド９ａ〜９ｄとコンタクト電極７とをボンデ
ィングワイヤ１０で接続する。
抵抗体の材料、膜厚、寸法等は発光素子の特性、ばらつ
き等の諸条件に応じて最適なもの全選択し得る。
尚、上記の実施例では、選択されたポンディングパッド
とコンタクト電極とをボンディングワイヤにより直接接
続しているが、第３図に示すように、各抵抗体のポンデ
ィングパッドのうち、対応する発光部に最も近いもの（
９ａ）とコンタクト電極とを接続し、トリミングのため
に選択されたポンディングパッドがポンディングパッド
９ａ以外のものであるとき、選択されたポンディングパ
ッド（９ｂ〜９ｄ）とポンディングパッド９ａと全ボン
ディングワイヤで接続するようにしてもよい。
〔効果〕
以上のように本発明によれば、各発光部に対応する帯状
の抵抗体に複数のポンディングパッドを設け、ポンディ
ングパッドの一つを選択してボンディングすることによ
りトリミーングを行なっているので、特別な工程を加え
ることなく、また従来の工程に大幅な変更を加えること
なく、トリミングを行なうことができる。また、ワイヤ
ボンディングの偉頼性は高いので、歩留りも高くなる。
【図面の簡単な説明】
第【図は本発明一実施例の発光装置を示す平面図、第２
図は第１図の■−■細断面図、第３図は本発明の池の実
施例の平面図である。 １・・・基板、２・・・共通電極、３・・・発光素子ア
レイ、４・・・結晶体、５・・・発光部、６・・・発光
窓、７・・・コンタクト電極、８・・・抵抗体、８ａ・
・・個別電極、９ａ〜９ｄ・・・ポンディングパッド、
ｉｏ・・・ボンディングワイヤ。 出願人代理人　　猪　股　　　清

Claims (1)

  1. 【特許請求の範囲】 （１）複数の発光部を有する発光素子アレイと、該アレ
    イの発光部にそれぞれ対応して基板上に設けられた帯状
    の抵抗体と、各抵抗体上に設けられた複数のポンディン
    グパッドとを備え、各発光部のコンタク［極と対応する
    抵抗体上のポンディングパッドの一つとをボンディング
    ワイヤにより面接または間接に接続するようにした半導
    体発光装置。 （２、特許請求の範囲第１項記載の発光装置において、
    各コンタク）！極と、対応する抵抗体の一端付近の第１
    のポンディングパッドと會ボンディングワイヤで接続し
    、トリミングのために選択されたポンディングパッドが
    前記第１のポンディングパッドとは異なる巣２のポンデ
    ィングパッドでめるとき、前記第１のポンディングパッ
    ドと前記第２のポンディングパッドとをボンディングワ
    イヤで接続するようにしたことを特徴とする発光装置。 （３）特許請求の範囲第１項記載の発光装置において、
    前記発光素子アレイを構成する半導体結晶体が、前記基
    板上の共通電極にダイボンディングされていること全特
    徴とする発光装置。
JP57230881A 1982-12-24 1982-12-24 半導体発光装置 Pending JPS59117280A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57230881A JPS59117280A (ja) 1982-12-24 1982-12-24 半導体発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57230881A JPS59117280A (ja) 1982-12-24 1982-12-24 半導体発光装置

Publications (1)

Publication Number Publication Date
JPS59117280A true JPS59117280A (ja) 1984-07-06

Family

ID=16914763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57230881A Pending JPS59117280A (ja) 1982-12-24 1982-12-24 半導体発光装置

Country Status (1)

Country Link
JP (1) JPS59117280A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104566U (ja) * 1984-12-14 1986-07-03
JPS62268170A (ja) * 1986-05-16 1987-11-20 Hitachi Cable Ltd 発光ダイオ−ドの発光強度調整方法および発光ダイオ−ドアレイ
EP0942474A3 (de) * 1998-03-11 2002-06-05 Siemens Aktiengesellschaft Leuchtdiode
JP2007080877A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd Ｌｅｄ光源の色調補正方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104566U (ja) * 1984-12-14 1986-07-03
JPS62268170A (ja) * 1986-05-16 1987-11-20 Hitachi Cable Ltd 発光ダイオ−ドの発光強度調整方法および発光ダイオ−ドアレイ
EP0942474A3 (de) * 1998-03-11 2002-06-05 Siemens Aktiengesellschaft Leuchtdiode
JP2007080877A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd Ｌｅｄ光源の色調補正方法

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