JPS5911457Y2 - 光結合半導体装置 - Google Patents

光結合半導体装置

Info

Publication number
JPS5911457Y2
JPS5911457Y2 JP1979069063U JP6906379U JPS5911457Y2 JP S5911457 Y2 JPS5911457 Y2 JP S5911457Y2 JP 1979069063 U JP1979069063 U JP 1979069063U JP 6906379 U JP6906379 U JP 6906379U JP S5911457 Y2 JPS5911457 Y2 JP S5911457Y2
Authority
JP
Japan
Prior art keywords
light
lead
light emitting
semiconductor device
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979069063U
Other languages
English (en)
Japanese (ja)
Other versions
JPS55169875U (https=
Inventor
祐史 富田
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1979069063U priority Critical patent/JPS5911457Y2/ja
Publication of JPS55169875U publication Critical patent/JPS55169875U/ja
Application granted granted Critical
Publication of JPS5911457Y2 publication Critical patent/JPS5911457Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1979069063U 1979-05-23 1979-05-23 光結合半導体装置 Expired JPS5911457Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979069063U JPS5911457Y2 (ja) 1979-05-23 1979-05-23 光結合半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979069063U JPS5911457Y2 (ja) 1979-05-23 1979-05-23 光結合半導体装置

Publications (2)

Publication Number Publication Date
JPS55169875U JPS55169875U (https=) 1980-12-05
JPS5911457Y2 true JPS5911457Y2 (ja) 1984-04-09

Family

ID=29302896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979069063U Expired JPS5911457Y2 (ja) 1979-05-23 1979-05-23 光結合半導体装置

Country Status (1)

Country Link
JP (1) JPS5911457Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202341516A (zh) * 2022-04-01 2023-10-16 日商松下知識產權經營股份有限公司 半導體繼電器及包括該半導體繼電器的半導體繼電器模組

Also Published As

Publication number Publication date
JPS55169875U (https=) 1980-12-05

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