JPS59109142U - 半導体素子の樹脂封入成形用金型装置 - Google Patents

半導体素子の樹脂封入成形用金型装置

Info

Publication number
JPS59109142U
JPS59109142U JP1983002031U JP203183U JPS59109142U JP S59109142 U JPS59109142 U JP S59109142U JP 1983002031 U JP1983002031 U JP 1983002031U JP 203183 U JP203183 U JP 203183U JP S59109142 U JPS59109142 U JP S59109142U
Authority
JP
Japan
Prior art keywords
mold
resin
cavity
semiconductor elements
resin encapsulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983002031U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6240433Y2 (enrdf_load_stackoverflow
Inventor
道男 長田
Original Assignee
有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 有限会社ティ・アンド・ケイ・インターナショナル研究所 filed Critical 有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority to JP1983002031U priority Critical patent/JPS59109142U/ja
Publication of JPS59109142U publication Critical patent/JPS59109142U/ja
Application granted granted Critical
Publication of JPS6240433Y2 publication Critical patent/JPS6240433Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP1983002031U 1983-01-11 1983-01-11 半導体素子の樹脂封入成形用金型装置 Granted JPS59109142U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983002031U JPS59109142U (ja) 1983-01-11 1983-01-11 半導体素子の樹脂封入成形用金型装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983002031U JPS59109142U (ja) 1983-01-11 1983-01-11 半導体素子の樹脂封入成形用金型装置

Publications (2)

Publication Number Publication Date
JPS59109142U true JPS59109142U (ja) 1984-07-23
JPS6240433Y2 JPS6240433Y2 (enrdf_load_stackoverflow) 1987-10-16

Family

ID=30133729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983002031U Granted JPS59109142U (ja) 1983-01-11 1983-01-11 半導体素子の樹脂封入成形用金型装置

Country Status (1)

Country Link
JP (1) JPS59109142U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005078807A1 (ja) * 2004-02-17 2005-08-25 Matsushita Electric Industrial Co., Ltd. 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005078807A1 (ja) * 2004-02-17 2005-08-25 Matsushita Electric Industrial Co., Ltd. 光電変換プラグとそれを用いた光電変換モジュール、及びその光電変換プラグの製造方法

Also Published As

Publication number Publication date
JPS6240433Y2 (enrdf_load_stackoverflow) 1987-10-16

Similar Documents

Publication Publication Date Title
JPS59107223U (ja) 環状樹脂成形品の樹脂成形用金型装置
JPS59109142U (ja) 半導体素子の樹脂封入成形用金型装置
JPS5961923U (ja) 射出成形用金型
JPS59109143U (ja) 半導体素子の樹脂封入成形用金型装置
JPS5874341U (ja) 半導体装置の樹脂モ−ルド装置
JPS583035U (ja) 樹脂モ−ルド用の型
JPS5967931U (ja) 樹脂モ−ルド装置
JPS6113952U (ja) 半導体装置用リ−ドフレ−ム
JPS60157053U (ja) 金型の位置決め装置
JPS60175612U (ja) 樹脂モ−ルド装置
JPS60125731U (ja) 樹脂モ−ルド装置
JPS6088717U (ja) 樹脂モ−ルド装置
JPS5844841U (ja) 樹脂封止形半導体装置のモ−ルド金型
JPS60125730U (ja) 半導体装置の樹脂封止金型
JPS6059531U (ja) 発光ダイオ−ドの樹脂封入成形用金型
JPS58171316U (ja) 樹脂モ−ルド装置
JPS5991812U (ja) 樹脂成形金型
JPS5911441U (ja) 半導体パツケ−ジ用モ−ルド金型
JPS58140647U (ja) リ−ドフレ−ム
JPS60156503U (ja) ハイブリッド・レンズ
JPS59164251U (ja) 半導体装置用リ−ドフレ−ム
JPS5839812U (ja) 樹脂封入成形用金型装置
JPS5920631U (ja) 半導体装置の樹脂モ−ルド装置
JPS5842938U (ja) 樹脂封止形半導体装置のモ−ルド金型
JPS59123344U (ja) 樹脂封止型半導体装置