JPS5895851A - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS5895851A
JPS5895851A JP56194025A JP19402581A JPS5895851A JP S5895851 A JPS5895851 A JP S5895851A JP 56194025 A JP56194025 A JP 56194025A JP 19402581 A JP19402581 A JP 19402581A JP S5895851 A JPS5895851 A JP S5895851A
Authority
JP
Japan
Prior art keywords
resin
frame
metallic
section
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56194025A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6227752B2 (enExample
Inventor
Tsutomu Ishiguro
石黒　勉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP56194025A priority Critical patent/JPS5895851A/ja
Publication of JPS5895851A publication Critical patent/JPS5895851A/ja
Publication of JPS6227752B2 publication Critical patent/JPS6227752B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56194025A 1981-12-02 1981-12-02 リ−ドフレ−ム Granted JPS5895851A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56194025A JPS5895851A (ja) 1981-12-02 1981-12-02 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56194025A JPS5895851A (ja) 1981-12-02 1981-12-02 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS5895851A true JPS5895851A (ja) 1983-06-07
JPS6227752B2 JPS6227752B2 (enExample) 1987-06-16

Family

ID=16317687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56194025A Granted JPS5895851A (ja) 1981-12-02 1981-12-02 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5895851A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4733014A (en) * 1982-05-26 1988-03-22 Asm-Fico Tooling B.V. Lead frame
US5343615A (en) * 1991-03-22 1994-09-06 Fujitsu Limited Semiconductor device and a process for making same having improved leads
EP1376691A3 (de) * 2002-06-21 2004-06-23 W. C. Heraeus GmbH & Co. KG Verfahren zur Herstellung von Systemträgern aus metallischem Trägerband sowie Metallstreifen mit Trägerbereich für elektrische Bauelemente

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4733014A (en) * 1982-05-26 1988-03-22 Asm-Fico Tooling B.V. Lead frame
US5343615A (en) * 1991-03-22 1994-09-06 Fujitsu Limited Semiconductor device and a process for making same having improved leads
EP1376691A3 (de) * 2002-06-21 2004-06-23 W. C. Heraeus GmbH & Co. KG Verfahren zur Herstellung von Systemträgern aus metallischem Trägerband sowie Metallstreifen mit Trägerbereich für elektrische Bauelemente

Also Published As

Publication number Publication date
JPS6227752B2 (enExample) 1987-06-16

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