JPS5890738A - 多層導体を有する素子 - Google Patents
多層導体を有する素子Info
- Publication number
- JPS5890738A JPS5890738A JP18880781A JP18880781A JPS5890738A JP S5890738 A JPS5890738 A JP S5890738A JP 18880781 A JP18880781 A JP 18880781A JP 18880781 A JP18880781 A JP 18880781A JP S5890738 A JPS5890738 A JP S5890738A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor
- carbon layer
- substrate
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18880781A JPS5890738A (ja) | 1981-11-25 | 1981-11-25 | 多層導体を有する素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18880781A JPS5890738A (ja) | 1981-11-25 | 1981-11-25 | 多層導体を有する素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5890738A true JPS5890738A (ja) | 1983-05-30 |
JPH0261142B2 JPH0261142B2 (enrdf_load_stackoverflow) | 1990-12-19 |
Family
ID=16230142
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18880781A Granted JPS5890738A (ja) | 1981-11-25 | 1981-11-25 | 多層導体を有する素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5890738A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0564435U (ja) * | 1992-01-31 | 1993-08-27 | スズキ株式会社 | エンジン用ガバナーのガバナー軸取付け装置 |
-
1981
- 1981-11-25 JP JP18880781A patent/JPS5890738A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0261142B2 (enrdf_load_stackoverflow) | 1990-12-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4510178A (en) | Thin film resistor material and method | |
US6143657A (en) | Method of increasing the stability of a copper to copper interconnection process and structure manufactured thereby | |
US4872050A (en) | Interconnection structure in semiconductor device and manufacturing method of the same | |
EP0107363B1 (en) | Method of producing anisotropically-conducting layers | |
US4457950A (en) | Process for producing wiring circuit board | |
US5240905A (en) | Method for forming electrode for electrical connections to oxide super-conductor | |
JPS5890738A (ja) | 多層導体を有する素子 | |
JPH01171247A (ja) | 超伝導体配線の構造 | |
US5274268A (en) | Electric circuit having superconducting layered structure | |
Mutoh et al. | Multilayer Metallization with Planar Interconnect Structure Utilizing CVD Al2 O 3 Film | |
US5357059A (en) | Construction of electrical connection to oxide superconductor | |
JPH0429319A (ja) | 半導体素子及びその製造方法 | |
JPS6261334A (ja) | パタ−ンの形成方法 | |
JPS56148845A (en) | Manufacture of semiconductor device | |
JPS54152984A (en) | Manufacture of semiconductor device | |
JPS5935451A (ja) | 層間絶縁膜の形成方法 | |
JPH07170043A (ja) | 配線基板 | |
JPS61203654A (ja) | 半導体装置及びその製造方法 | |
JPH0594961A (ja) | 超伝導配線の製造方法 | |
GB2135123A (en) | Multi-level metallizatien structure for semiconductor device and method of making same | |
JPH0669426A (ja) | 半導体装置 | |
JPH03291920A (ja) | コンタクト孔埋め込み方法 | |
JPS61113259A (ja) | 半導体装置の製造方法 | |
JPH05291416A (ja) | 多層配線の形成方法 | |
JPS6085532A (ja) | 半導体装置の製造方法 |