JPS5887841A - 半導体素子のボンデイング用Ａｌ線 - Google Patents

半導体素子のボンデイング用Ａｌ線

Info

Publication number
JPS5887841A
JPS5887841A JP56187332A JP18733281A JPS5887841A JP S5887841 A JPS5887841 A JP S5887841A JP 56187332 A JP56187332 A JP 56187332A JP 18733281 A JP18733281 A JP 18733281A JP S5887841 A JPS5887841 A JP S5887841A
Authority
JP
Japan
Prior art keywords
bonding
wire
strength
tensile strength
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56187332A
Other languages
English (en)
Japanese (ja)
Other versions
JPS645460B2 (cg-RX-API-DMAC10.html
Inventor
Shozo Hayashi
林　正蔵
Yasuo Fukui
福井　康夫
Kenichi Kurihara
健一 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP56187332A priority Critical patent/JPS5887841A/ja
Publication of JPS5887841A publication Critical patent/JPS5887841A/ja
Publication of JPS645460B2 publication Critical patent/JPS645460B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP56187332A 1981-11-20 1981-11-20 半導体素子のボンデイング用Ａｌ線 Granted JPS5887841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56187332A JPS5887841A (ja) 1981-11-20 1981-11-20 半導体素子のボンデイング用Ａｌ線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56187332A JPS5887841A (ja) 1981-11-20 1981-11-20 半導体素子のボンデイング用Ａｌ線

Publications (2)

Publication Number Publication Date
JPS5887841A true JPS5887841A (ja) 1983-05-25
JPS645460B2 JPS645460B2 (cg-RX-API-DMAC10.html) 1989-01-30

Family

ID=16204141

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56187332A Granted JPS5887841A (ja) 1981-11-20 1981-11-20 半導体素子のボンデイング用Ａｌ線

Country Status (1)

Country Link
JP (1) JPS5887841A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208770A (ja) * 1983-05-12 1984-11-27 Hitachi Ltd ボ−ルボンデイング用アルミ合金極細線
JPS607164A (ja) * 1983-06-24 1985-01-14 Sumitomo Electric Ind Ltd ボンデイングワイヤ
JPS607165A (ja) * 1983-06-24 1985-01-14 Sumitomo Electric Ind Ltd ボンディングワイヤ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208770A (ja) * 1983-05-12 1984-11-27 Hitachi Ltd ボ−ルボンデイング用アルミ合金極細線
JPS607164A (ja) * 1983-06-24 1985-01-14 Sumitomo Electric Ind Ltd ボンデイングワイヤ
JPS607165A (ja) * 1983-06-24 1985-01-14 Sumitomo Electric Ind Ltd ボンディングワイヤ

Also Published As

Publication number Publication date
JPS645460B2 (cg-RX-API-DMAC10.html) 1989-01-30

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