JPS588608A - 樹脂封止形半導体装置成形用モ−ルド金型 - Google Patents

樹脂封止形半導体装置成形用モ−ルド金型

Info

Publication number
JPS588608A
JPS588608A JP56106768A JP10676881A JPS588608A JP S588608 A JPS588608 A JP S588608A JP 56106768 A JP56106768 A JP 56106768A JP 10676881 A JP10676881 A JP 10676881A JP S588608 A JPS588608 A JP S588608A
Authority
JP
Japan
Prior art keywords
cavity insert
mold
groove
cavity
discharge machining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56106768A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0239368B2 (enExample
Inventor
Hiromichi Yamada
弘道 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56106768A priority Critical patent/JPS588608A/ja
Publication of JPS588608A publication Critical patent/JPS588608A/ja
Publication of JPH0239368B2 publication Critical patent/JPH0239368B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP56106768A 1981-07-08 1981-07-08 樹脂封止形半導体装置成形用モ−ルド金型 Granted JPS588608A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56106768A JPS588608A (ja) 1981-07-08 1981-07-08 樹脂封止形半導体装置成形用モ−ルド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56106768A JPS588608A (ja) 1981-07-08 1981-07-08 樹脂封止形半導体装置成形用モ−ルド金型

Publications (2)

Publication Number Publication Date
JPS588608A true JPS588608A (ja) 1983-01-18
JPH0239368B2 JPH0239368B2 (enExample) 1990-09-05

Family

ID=14442079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56106768A Granted JPS588608A (ja) 1981-07-08 1981-07-08 樹脂封止形半導体装置成形用モ−ルド金型

Country Status (1)

Country Link
JP (1) JPS588608A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4560138A (en) * 1983-11-25 1985-12-24 Depuglia Gaston D Encapsulation mold
JPH06111653A (ja) * 1991-09-28 1994-04-22 Omron Corp 電気機器の端子金具インサート部成型方法
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
CN108161380A (zh) * 2017-12-04 2018-06-15 南通斯迈尔精密设备有限公司 一种半导体封装模具的型腔加工工艺
CN108608179A (zh) * 2018-04-12 2018-10-02 无锡市迈科密精密机械有限公司 一种模具加工工艺

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4560138A (en) * 1983-11-25 1985-12-24 Depuglia Gaston D Encapsulation mold
JPH06111653A (ja) * 1991-09-28 1994-04-22 Omron Corp 電気機器の端子金具インサート部成型方法
US5316463A (en) * 1992-11-24 1994-05-31 Neu Dynamics Corporation Encapsulating molding equipment
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
US5429488A (en) * 1992-11-24 1995-07-04 Neu Dynamics Corporation Encapsulating molding equipment and method
US5484274A (en) * 1992-11-24 1996-01-16 Neu Dynamics Corp. Encapsulation molding equipment
CN108161380A (zh) * 2017-12-04 2018-06-15 南通斯迈尔精密设备有限公司 一种半导体封装模具的型腔加工工艺
CN108608179A (zh) * 2018-04-12 2018-10-02 无锡市迈科密精密机械有限公司 一种模具加工工艺

Also Published As

Publication number Publication date
JPH0239368B2 (enExample) 1990-09-05

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