JPS5883148U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5883148U
JPS5883148U JP17973681U JP17973681U JPS5883148U JP S5883148 U JPS5883148 U JP S5883148U JP 17973681 U JP17973681 U JP 17973681U JP 17973681 U JP17973681 U JP 17973681U JP S5883148 U JPS5883148 U JP S5883148U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
pellet
semiconductor device
soldered
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17973681U
Other languages
English (en)
Inventor
溝上　繁男
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP17973681U priority Critical patent/JPS5883148U/ja
Publication of JPS5883148U publication Critical patent/JPS5883148U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図は、従来の半導体装置のペレット固着
構体の断面図、第３図は、この考案の一実施例を示す半
導体装置のペレット固着構体の断面図、第４図は、その
ペレット及びフランジの平面図、第５図は、ペレット固
着作業中のペレットマウント構体の断面図である。 ７・・・・・・ステム基板、１０・・・・・・ペレット
、１０′・・・・・・側面、１１・・・・・・フランジ
、１２・・・・・・半田。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板に半田付固着するペレットの側面に、耐熱性かつ絶
    縁性のフランジを４レツトの固着面と平坦な下面を有す
    るように延在取付けしたことを特徴とする半導体装置。
JP17973681U 1981-11-30 1981-11-30 半導体装置 Pending JPS5883148U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17973681U JPS5883148U (ja) 1981-11-30 1981-11-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17973681U JPS5883148U (ja) 1981-11-30 1981-11-30 半導体装置

Publications (1)

Publication Number Publication Date
JPS5883148U true JPS5883148U (ja) 1983-06-06

Family

ID=29975698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17973681U Pending JPS5883148U (ja) 1981-11-30 1981-11-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS5883148U (ja)

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