JPS5882550A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5882550A
JPS5882550A JP18023781A JP18023781A JPS5882550A JP S5882550 A JPS5882550 A JP S5882550A JP 18023781 A JP18023781 A JP 18023781A JP 18023781 A JP18023781 A JP 18023781A JP S5882550 A JPS5882550 A JP S5882550A
Authority
JP
Japan
Prior art keywords
heat dissipation
heat
dissipation structure
package
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18023781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6231830B2 (enrdf_load_stackoverflow
Inventor
Eiji Aoki
英二 青木
Masahiro Sugimoto
杉本　正浩
Tetsushi Wakabayashi
哲史 若林
Kiyoshi Muratake
村竹　清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18023781A priority Critical patent/JPS5882550A/ja
Priority to EP19820305961 priority patent/EP0079238B1/en
Priority to DE8282305961T priority patent/DE3278321D1/de
Priority to IE268182A priority patent/IE54087B1/en
Publication of JPS5882550A publication Critical patent/JPS5882550A/ja
Publication of JPS6231830B2 publication Critical patent/JPS6231830B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP18023781A 1981-11-10 1981-11-10 半導体装置 Granted JPS5882550A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP18023781A JPS5882550A (ja) 1981-11-10 1981-11-10 半導体装置
EP19820305961 EP0079238B1 (en) 1981-11-10 1982-11-09 Semiconductor devices provided with heat-dissipating means
DE8282305961T DE3278321D1 (en) 1981-11-10 1982-11-09 Semiconductor devices provided with heat-dissipating means
IE268182A IE54087B1 (en) 1981-11-10 1982-11-10 Semiconductor devices provided with heat-dissipating means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18023781A JPS5882550A (ja) 1981-11-10 1981-11-10 半導体装置

Publications (2)

Publication Number Publication Date
JPS5882550A true JPS5882550A (ja) 1983-05-18
JPS6231830B2 JPS6231830B2 (enrdf_load_stackoverflow) 1987-07-10

Family

ID=16079760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18023781A Granted JPS5882550A (ja) 1981-11-10 1981-11-10 半導体装置

Country Status (1)

Country Link
JP (1) JPS5882550A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425129U (enrdf_load_stackoverflow) * 1990-06-26 1992-02-28

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit

Also Published As

Publication number Publication date
JPS6231830B2 (enrdf_load_stackoverflow) 1987-07-10

Similar Documents

Publication Publication Date Title
JP2000156436A (ja) 半導体素子および半導体チップのパッケ―ジ方法
US4012768A (en) Semiconductor package
KR20080015724A (ko) 몰딩된 리드 부착물을 갖는 플라스틱 오버몰딩된 패키지들
JPH0744247B2 (ja) 半導体装置用容器
JPS5882550A (ja) 半導体装置
JPS63308943A (ja) 半導体装置
JPH03180054A (ja) 樹脂封止型半導体装置
JPH07263618A (ja) 混成集積回路装置
JP2002016196A (ja) リードフレーム、およびそれを用いた樹脂封止形半導体装置
JPH1065072A (ja) 放熱電極構造
JPS63169749A (ja) 半導体装置
JPS6220701B2 (enrdf_load_stackoverflow)
JPS61137350A (ja) 放熱形金属パツケ−ジ
JPH0412557A (ja) 半導体パッケージの放熱構造
JPS61120451A (ja) 半導体容器
JPS5965458A (ja) 半導体装置の製造方法
JPS6120772Y2 (enrdf_load_stackoverflow)
JP2001127218A (ja) 半導体装置および半導体装置の製造方法
JPH0448768A (ja) 半導体装置及びその製造方法
JPH02240953A (ja) 半導体装置
JPH0797616B2 (ja) 半導体装置の製造方法
JPS6233331Y2 (enrdf_load_stackoverflow)
JPH07202067A (ja) ヒートシンク付ピングリッドアレイ
JPH02234457A (ja) 放熱体を有する半導体装置用パッケージ
JPH0778918A (ja) 半導体装置