JPS6231830B2 - - Google Patents

Info

Publication number
JPS6231830B2
JPS6231830B2 JP56180237A JP18023781A JPS6231830B2 JP S6231830 B2 JPS6231830 B2 JP S6231830B2 JP 56180237 A JP56180237 A JP 56180237A JP 18023781 A JP18023781 A JP 18023781A JP S6231830 B2 JPS6231830 B2 JP S6231830B2
Authority
JP
Japan
Prior art keywords
heat
package
thermally conductive
heat transfer
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56180237A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5882550A (ja
Inventor
Eiji Aoki
Masahiro Sugimoto
Tetsushi Wakabayashi
Kyoshi Muratake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP18023781A priority Critical patent/JPS5882550A/ja
Priority to DE8282305961T priority patent/DE3278321D1/de
Priority to EP19820305961 priority patent/EP0079238B1/en
Priority to IE268182A priority patent/IE54087B1/en
Publication of JPS5882550A publication Critical patent/JPS5882550A/ja
Publication of JPS6231830B2 publication Critical patent/JPS6231830B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP18023781A 1981-11-10 1981-11-10 半導体装置 Granted JPS5882550A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP18023781A JPS5882550A (ja) 1981-11-10 1981-11-10 半導体装置
DE8282305961T DE3278321D1 (en) 1981-11-10 1982-11-09 Semiconductor devices provided with heat-dissipating means
EP19820305961 EP0079238B1 (en) 1981-11-10 1982-11-09 Semiconductor devices provided with heat-dissipating means
IE268182A IE54087B1 (en) 1981-11-10 1982-11-10 Semiconductor devices provided with heat-dissipating means

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18023781A JPS5882550A (ja) 1981-11-10 1981-11-10 半導体装置

Publications (2)

Publication Number Publication Date
JPS5882550A JPS5882550A (ja) 1983-05-18
JPS6231830B2 true JPS6231830B2 (enrdf_load_stackoverflow) 1987-07-10

Family

ID=16079760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18023781A Granted JPS5882550A (ja) 1981-11-10 1981-11-10 半導体装置

Country Status (1)

Country Link
JP (1) JPS5882550A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425129U (enrdf_load_stackoverflow) * 1990-06-26 1992-02-28

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553617A (en) * 1978-06-21 1980-01-11 Hitachi Ltd Metallic base for hybrid integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0425129U (enrdf_load_stackoverflow) * 1990-06-26 1992-02-28

Also Published As

Publication number Publication date
JPS5882550A (ja) 1983-05-18

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