JPS5870563A - 半導体部品のための電気接続片 - Google Patents

半導体部品のための電気接続片

Info

Publication number
JPS5870563A
JPS5870563A JP57119197A JP11919782A JPS5870563A JP S5870563 A JPS5870563 A JP S5870563A JP 57119197 A JP57119197 A JP 57119197A JP 11919782 A JP11919782 A JP 11919782A JP S5870563 A JPS5870563 A JP S5870563A
Authority
JP
Japan
Prior art keywords
piece
connecting piece
soldering
connection
curved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57119197A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6362096B2 (enExample
Inventor
アルノ・ナイデイツヒ
アルタン・アキユレク
フ−ベルト・ヘツトマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BURAUN BOBERI UNTO CO AG
Original Assignee
BBC BROWN BOVERI and CIE
BURAUN BOBERI UNTO CO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, BURAUN BOBERI UNTO CO AG filed Critical BBC BROWN BOVERI and CIE
Publication of JPS5870563A publication Critical patent/JPS5870563A/ja
Publication of JPS6362096B2 publication Critical patent/JPS6362096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H10W72/07141—
    • H10W72/07636—
    • H10W72/07652—
    • H10W72/627—
    • H10W72/631—
    • H10W72/652—
    • H10W72/655—
    • H10W72/926—
    • H10W90/754—
    • H10W90/764—

Landscapes

  • Thyristors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
JP57119197A 1981-07-11 1982-07-10 半導体部品のための電気接続片 Granted JPS5870563A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813127458 DE3127458A1 (de) 1981-07-11 1981-07-11 Elektrische verbindungslasche fuer halbleiterbauelemente
DE3127458.7 1981-07-11

Publications (2)

Publication Number Publication Date
JPS5870563A true JPS5870563A (ja) 1983-04-27
JPS6362096B2 JPS6362096B2 (enExample) 1988-12-01

Family

ID=6136701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57119197A Granted JPS5870563A (ja) 1981-07-11 1982-07-10 半導体部品のための電気接続片

Country Status (5)

Country Link
US (1) US4502750A (enExample)
EP (1) EP0069903B1 (enExample)
JP (1) JPS5870563A (enExample)
AT (1) ATE23003T1 (enExample)
DE (1) DE3127458A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018092707A1 (ja) 2016-11-16 2018-05-24 日本精工株式会社 転がり軸受用保持器、及び転がり軸受

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung
DE3406537A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat
DE3528427A1 (de) * 1985-08-08 1987-04-02 Bbc Brown Boveri & Cie Elektrische verbindungslasche fuer halbleiterbauelemente
DE4300516C2 (de) * 1993-01-12 2001-05-17 Ixys Semiconductor Gmbh Leistungshalbleitermodul
US6485603B1 (en) * 1999-07-01 2002-11-26 Applied Materials, Inc. Method and apparatus for conserving energy within a process chamber
US6267630B1 (en) 1999-08-04 2001-07-31 Antaya Technologies Corporation Circular connector with blade terminal

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE950068C (de) * 1953-01-20 1956-10-04 Nelken Kg Dr Ewald Elektrischer Schienenverbinder
DE1514805B2 (de) * 1965-04-03 1971-08-19 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum kontaktieren von halbleiterbauelementen
US4023008A (en) * 1972-12-28 1977-05-10 Saint-Gobain Industries Terminal connection for electric heaters for vehicle windows
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US4054238A (en) * 1976-03-23 1977-10-18 Western Electric Company, Inc. Method, apparatus and lead frame for assembling leads with terminals on a substrate
DE2728330A1 (de) * 1977-06-23 1979-01-11 Siemens Ag Verfahren zum verloeten von kontaktteilen und/oder halbleiterplaettchen
US4151544A (en) * 1977-12-27 1979-04-24 Motorola, Inc. Lead terminal for button diode
US4246467A (en) * 1979-07-20 1981-01-20 Ford Motor Company Electric terminal for connecting a heating grid on a thermal window

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018092707A1 (ja) 2016-11-16 2018-05-24 日本精工株式会社 転がり軸受用保持器、及び転がり軸受
KR20190062571A (ko) 2016-11-16 2019-06-05 닛본 세이고 가부시끼가이샤 구름 베어링용 유지기, 및 구름 베어링

Also Published As

Publication number Publication date
DE3127458A1 (de) 1983-02-03
EP0069903A2 (de) 1983-01-19
JPS6362096B2 (enExample) 1988-12-01
US4502750A (en) 1985-03-05
EP0069903B1 (de) 1986-10-15
ATE23003T1 (de) 1986-11-15
EP0069903A3 (en) 1984-11-28
DE3127458C2 (enExample) 1987-06-25

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