JPS5870563A - 半導体部品のための電気接続片 - Google Patents

半導体部品のための電気接続片

Info

Publication number
JPS5870563A
JPS5870563A JP57119197A JP11919782A JPS5870563A JP S5870563 A JPS5870563 A JP S5870563A JP 57119197 A JP57119197 A JP 57119197A JP 11919782 A JP11919782 A JP 11919782A JP S5870563 A JPS5870563 A JP S5870563A
Authority
JP
Japan
Prior art keywords
piece
connecting piece
soldering
connection
curved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57119197A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6362096B2 (enExample
Inventor
アルノ・ナイデイツヒ
アルタン・アキユレク
フ−ベルト・ヘツトマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BURAUN BOBERI UNTO CO AG
Original Assignee
BBC BROWN BOVERI and CIE
BURAUN BOBERI UNTO CO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, BURAUN BOBERI UNTO CO AG filed Critical BBC BROWN BOVERI and CIE
Publication of JPS5870563A publication Critical patent/JPS5870563A/ja
Publication of JPS6362096B2 publication Critical patent/JPS6362096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07652—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/621—Structures or relative sizes of strap connectors
    • H10W72/627—Multiple strap connectors having different structures or shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/655—Materials of strap connectors of outermost layers of multilayered strap connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP57119197A 1981-07-11 1982-07-10 半導体部品のための電気接続片 Granted JPS5870563A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813127458 DE3127458A1 (de) 1981-07-11 1981-07-11 Elektrische verbindungslasche fuer halbleiterbauelemente
DE3127458.7 1981-07-11

Publications (2)

Publication Number Publication Date
JPS5870563A true JPS5870563A (ja) 1983-04-27
JPS6362096B2 JPS6362096B2 (enExample) 1988-12-01

Family

ID=6136701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57119197A Granted JPS5870563A (ja) 1981-07-11 1982-07-10 半導体部品のための電気接続片

Country Status (5)

Country Link
US (1) US4502750A (enExample)
EP (1) EP0069903B1 (enExample)
JP (1) JPS5870563A (enExample)
AT (1) ATE23003T1 (enExample)
DE (1) DE3127458A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018092707A1 (ja) 2016-11-16 2018-05-24 日本精工株式会社 転がり軸受用保持器、及び転がり軸受

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406537A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat
DE3406538A1 (de) * 1984-02-23 1985-08-29 Bbc Brown Boveri & Cie Leistungshalbleitermodul und verfahren zur herstellung
DE3528427A1 (de) * 1985-08-08 1987-04-02 Bbc Brown Boveri & Cie Elektrische verbindungslasche fuer halbleiterbauelemente
DE4300516C2 (de) * 1993-01-12 2001-05-17 Ixys Semiconductor Gmbh Leistungshalbleitermodul
US6485603B1 (en) * 1999-07-01 2002-11-26 Applied Materials, Inc. Method and apparatus for conserving energy within a process chamber
US6267630B1 (en) 1999-08-04 2001-07-31 Antaya Technologies Corporation Circular connector with blade terminal

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE950068C (de) * 1953-01-20 1956-10-04 Nelken Kg Dr Ewald Elektrischer Schienenverbinder
DE1514805B2 (de) * 1965-04-03 1971-08-19 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum kontaktieren von halbleiterbauelementen
US4023008A (en) * 1972-12-28 1977-05-10 Saint-Gobain Industries Terminal connection for electric heaters for vehicle windows
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US4054238A (en) * 1976-03-23 1977-10-18 Western Electric Company, Inc. Method, apparatus and lead frame for assembling leads with terminals on a substrate
DE2728330A1 (de) * 1977-06-23 1979-01-11 Siemens Ag Verfahren zum verloeten von kontaktteilen und/oder halbleiterplaettchen
US4151544A (en) * 1977-12-27 1979-04-24 Motorola, Inc. Lead terminal for button diode
US4246467A (en) * 1979-07-20 1981-01-20 Ford Motor Company Electric terminal for connecting a heating grid on a thermal window

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018092707A1 (ja) 2016-11-16 2018-05-24 日本精工株式会社 転がり軸受用保持器、及び転がり軸受
KR20190062571A (ko) 2016-11-16 2019-06-05 닛본 세이고 가부시끼가이샤 구름 베어링용 유지기, 및 구름 베어링

Also Published As

Publication number Publication date
JPS6362096B2 (enExample) 1988-12-01
EP0069903B1 (de) 1986-10-15
US4502750A (en) 1985-03-05
EP0069903A3 (en) 1984-11-28
DE3127458C2 (enExample) 1987-06-25
DE3127458A1 (de) 1983-02-03
ATE23003T1 (de) 1986-11-15
EP0069903A2 (de) 1983-01-19

Similar Documents

Publication Publication Date Title
JPS5870563A (ja) 半導体部品のための電気接続片
US5867895A (en) Method of mounting an electrical component with surface-mountable terminals
JPH0436114Y2 (enExample)
JP2002164246A (ja) 電子部品
JP3624740B2 (ja) セラミック電子部品
JP2020088183A (ja) 配線基板及び電子装置
JP3832165B2 (ja) ポリマｐｔｃサーミスタ
JPH0331043Y2 (enExample)
JPH06120071A (ja) チップ部品
JP2817873B2 (ja) 混成集積回路基板及びその製造方法
JP2545602Y2 (ja) ジャンパチップ
JPS6127193Y2 (enExample)
JPH01179491A (ja) 回路基板
JPH05315337A (ja) 半導体装置用電極とその実装体
JP2502644B2 (ja) 厚膜回路基板
JPH07297003A (ja) 電子部品用金属端子付き基板
JPH0729660Y2 (ja) 回路装置
JPH0535589B2 (enExample)
JPH10284199A (ja) 半田ボール付きコネクタ
JPS5828380Y2 (ja) 印刷配線板
JPH04335542A (ja) 半導体装置の実装体
JPS6051236B2 (ja) 電気配線回路板の電気接続方法
JPS6384096A (ja) 回路基板
JPH07297542A (ja) フレキシブルプリント基板のハンダ接続方法
JPH10223402A (ja) チップ部品