JPS5864057A - Ａｌスポツトリ−ドフレ−ムの製造法 - Google Patents

Ａｌスポツトリ−ドフレ−ムの製造法

Info

Publication number
JPS5864057A
JPS5864057A JP56164598A JP16459881A JPS5864057A JP S5864057 A JPS5864057 A JP S5864057A JP 56164598 A JP56164598 A JP 56164598A JP 16459881 A JP16459881 A JP 16459881A JP S5864057 A JPS5864057 A JP S5864057A
Authority
JP
Japan
Prior art keywords
lead frame
tape
continuously
coated
prescribed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56164598A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6248386B2 (enExample
Inventor
Nobuo Ogasa
小笠　伸夫
Akira Otsuka
昭 大塚
Fumio Ootsuji
大辻　文雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP56164598A priority Critical patent/JPS5864057A/ja
Publication of JPS5864057A publication Critical patent/JPS5864057A/ja
Publication of JPS6248386B2 publication Critical patent/JPS6248386B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/042—Etching

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP56164598A 1981-10-14 1981-10-14 Ａｌスポツトリ−ドフレ−ムの製造法 Granted JPS5864057A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56164598A JPS5864057A (ja) 1981-10-14 1981-10-14 Ａｌスポツトリ−ドフレ−ムの製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56164598A JPS5864057A (ja) 1981-10-14 1981-10-14 Ａｌスポツトリ−ドフレ−ムの製造法

Publications (2)

Publication Number Publication Date
JPS5864057A true JPS5864057A (ja) 1983-04-16
JPS6248386B2 JPS6248386B2 (enExample) 1987-10-13

Family

ID=15796215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56164598A Granted JPS5864057A (ja) 1981-10-14 1981-10-14 Ａｌスポツトリ−ドフレ−ムの製造法

Country Status (1)

Country Link
JP (1) JPS5864057A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63167747U (enExample) * 1987-04-21 1988-11-01
JPS63265453A (ja) * 1987-04-22 1988-11-01 Mitsubishi Electric Corp 半導体用リ−ドフレ−ムの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63167747U (enExample) * 1987-04-21 1988-11-01
JPS63265453A (ja) * 1987-04-22 1988-11-01 Mitsubishi Electric Corp 半導体用リ−ドフレ−ムの製造方法

Also Published As

Publication number Publication date
JPS6248386B2 (enExample) 1987-10-13

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