JPS586153A - 電子部品 - Google Patents

電子部品

Info

Publication number
JPS586153A
JPS586153A JP57108598A JP10859882A JPS586153A JP S586153 A JPS586153 A JP S586153A JP 57108598 A JP57108598 A JP 57108598A JP 10859882 A JP10859882 A JP 10859882A JP S586153 A JPS586153 A JP S586153A
Authority
JP
Japan
Prior art keywords
casing
electronic component
welding position
socket plate
led out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57108598A
Other languages
English (en)
Other versions
JPH0558260B2 (ja
Inventor
マンフレツド・フリスタ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPS586153A publication Critical patent/JPS586153A/ja
Publication of JPH0558260B2 publication Critical patent/JPH0558260B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は、ケーシングとケーシイグから外部へ導出され
た少なくとも２つの接続ピンを有する、電気回路装置に
用いられる電子部品に関する。この穐類の電子１部品は
公知である。さらに、電子部品の接続−ンｔプリント配
線板にろう付するか或いｉ金属の接続パーに溶接するこ
とによりこの電子部品を装置の−の部品に接続すること
が公知である。さらに電子部品の接続ピンを弾性金属部
分に差込み接続することも公知である。しかしその場合
電気接続の自由度に限界がある。さらに電気接続は頻繁
に周囲の環境の影響を受ける。
本発明の効果および利点 特許請求の範囲第１項記載の特徴を有する本発明の電子
部品はそれに対し、電気接続に大きな自由度があり、さ
らに周囲の環境の影響から溶接位置が保護される。
本発明の電子部品の実施例につき図を用いて以下詳細に
説明する。
実施例の説明 第１図に示された電子部品５０はソケットプレート２及
びメタルキャップ１から構成される金属ケーシングを有
している。メタルキャップ１はソケットプレート２の上
に溶接されている。ケーシングの内部において半導体材
３がソケットプレート２の上にろう付されているかまた
は接着されている。部品の外部接触接続のために接続ビ
ン５．６が用いられる。この接続ビンはガラス封入部を
介してソケットプレート２を絶縁されて貫通されている
。半導体材３から接続ビン５．６にボンＰ線牛、４′　
　が導かれている。電子部品、５０と装置の他の部分と
の導電接続のために接続線１１．１２が接続ビン５．６
に直接溶接されている。溶接位置を保護するために円筒
状に形成された金属ケーシング８が設ケられており、こ
のケーシングの中に溶接位置は存在している。円筒状に
形成されたケーシング８は絶縁性の、腐食保護プラスチ
ック材１０により充填されており、このプラスチック材
は溶接位置？被覆している。ケーシング８はソケットプ
レート２にねじで固定されている。接続線１１．１２は
ケーシング８からスリット９１！Ｉ−通り外部へ導出さ
れている。７はソケットプレート２の固定のためのビス
で、この固定穴にねじ込まれている。１３及び１３　は
ケーシング８の固定穴會示し、この固定穴は装置におい
て装置全体の連結接続のためにある。ケーシング８は押
出しプレス成形部分で作ることができる。
【図面の簡単な説明】
第１図は溶接位置及び付卯的に設けられて円筒状に形成
されたケーシングを有する電子部品の縦断面図、第２図
は第１図における装置と同じ装置の平面図を示す。

Claims (1)

  1. 【特許請求の範囲】 １、　ケーシング（１，２）とケーシングから外部へ導
    出された少なくとも２つの接続ピン（５，６）ｔ−有す
    る、電気回路装置に用いられる電子部品において、電子
    部品ｔ−ｈ路装置の他の部分と導電接続するために接続
    線（１１，１２）が前記接続ピン（５，６）に直接溶接
    されており、溶接位置を保護するためＩ（円筒状に形成
    されたケーシング（８）が設けられており、このケーシ
    ングの中に溶接位置が存在し、円筒状に形成されたケー
    シング（８）は絶縁性の腐食保護プラスチック材（１０
    ）により充填されており、このプラスチック材が溶接位
    置全被覆しているととｔ特徴とする電子部品。 ２、溶接位置の保護に用いられるケーシング（８）が金
    属から形成されソケットプレート（２）に良好な熱伝導
    が生ずるように固定されており、このケーシングが熱放
    散に役立つ金属のソケットプレート（２）ｔ−有し、こ
    のソケットプレートを通って接続ピン（５，６）が絶縁
    されて貫通されている特許請求の範囲第１項記載の電子
    部品。 ３、接続ピン（５，６）に溶接されている線（１１，１
    ２）が溶接位置の保護ｔするケーシング（８）からスリ
    ット（９）を経て導出されている特許請求の範囲第１項
    記載の電子部品。
JP57108598A 1981-06-27 1982-06-25 電子部品 Granted JPS586153A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19813125360 DE3125360A1 (de) 1981-06-27 1981-06-27 "elektronisches bauelement"
DE3125360.1 1981-06-27

Publications (2)

Publication Number Publication Date
JPS586153A true JPS586153A (ja) 1983-01-13
JPH0558260B2 JPH0558260B2 (ja) 1993-08-26

Family

ID=6135531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57108598A Granted JPS586153A (ja) 1981-06-27 1982-06-25 電子部品

Country Status (4)

Country Link
JP (1) JPS586153A (ja)
DE (1) DE3125360A1 (ja)
ES (1) ES273620Y (ja)
FR (1) FR2508705B1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03185380A (ja) * 1989-12-14 1991-08-13 Furuno Electric Co Ltd 水中探知装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907067A (en) * 1988-05-11 1990-03-06 Texas Instruments Incorporated Thermally efficient power device package

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS432111Y1 (ja) * 1964-05-23 1968-01-29
JPS4853256U (ja) * 1971-10-26 1973-07-10
JPS502506U (ja) * 1973-05-08 1975-01-11
JPS5093566A (ja) * 1973-12-20 1975-07-25
JPS51113464A (en) * 1975-03-28 1976-10-06 Fujitsu Ltd Compound electronic component manufacturing system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1369793A (fr) * 1962-09-21 1964-08-14 Westinghouse Electric Corp Dispositif semi-conducteur étanche
JPS5128829B1 (ja) * 1968-10-21 1976-08-21
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS432111Y1 (ja) * 1964-05-23 1968-01-29
JPS4853256U (ja) * 1971-10-26 1973-07-10
JPS502506U (ja) * 1973-05-08 1975-01-11
JPS5093566A (ja) * 1973-12-20 1975-07-25
JPS51113464A (en) * 1975-03-28 1976-10-06 Fujitsu Ltd Compound electronic component manufacturing system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03185380A (ja) * 1989-12-14 1991-08-13 Furuno Electric Co Ltd 水中探知装置

Also Published As

Publication number Publication date
ES273620U (es) 1984-03-01
JPH0558260B2 (ja) 1993-08-26
DE3125360A1 (de) 1983-01-13
FR2508705A1 (fr) 1982-12-31
DE3125360C2 (ja) 1989-11-30
FR2508705B1 (fr) 1985-12-27
ES273620Y (es) 1984-10-01

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