ES273620U - Componente electronico del tipo insertado en una carcasa. - Google Patents

Componente electronico del tipo insertado en una carcasa.

Info

Publication number
ES273620U
ES273620U ES1982273620U ES273620U ES273620U ES 273620 U ES273620 U ES 273620U ES 1982273620 U ES1982273620 U ES 1982273620U ES 273620 U ES273620 U ES 273620U ES 273620 U ES273620 U ES 273620U
Authority
ES
Spain
Prior art keywords
casing
electronic component
housing
welding point
connection pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES1982273620U
Other languages
English (en)
Other versions
ES273620Y (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of ES273620U publication Critical patent/ES273620U/es
Application granted granted Critical
Publication of ES273620Y publication Critical patent/ES273620Y/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

1. Componente electrónico, del tipo insertado en una carcasa (50) contenido en un circuito, que tiene una carcasa (1, 2), y al menos dos clavijas de conexión (5, 6) que sobresalen de la carcasa, caracterizado porque se han soldado directamente sobre las clavijas de conexión (5, 6) conductores de conexión (11, 12) para la conexión eléctricamente conductora del componente electrónico (50) con otras partes del circuito y porque, para la protección del punto de soldadura se ha previsto una carcasa (8) configurada de forma cilíndrica, en la que se ha alojado un punto de soldadura y porque la carcasa configurada de forma cilíndrica (8) está rellena con una masa sintética (10) aislante y protectora contra la corrosión que rodea el punto de soldadura. 2. Componente electrónico, según la reivindicación 1, caracterizado porque la carcasa (1, 2) contiene una placa de zócalo (2) metálica que sirve para la disipación del calor, a través de la cual se han hecho parsar las clavijas de conexión (5, 6) aisladamente, estando consituida la carcasa (8) que sirve para la protección del punto de soldadura también de metal y está fijada sobre la placa de zócalo (2) de forma que sea buena conductora del calor. 3. Componente electrónico según las reivindiaciones 1 y 2, caracterizado porque los conductores (11, 12) soldados en las clavijas de conexión (5, 6) salen de la carcasa (8) que sirve para la protección del punto de soldadura, a través de una ranura (9). 4. Componente electrónico del tipo insertado en una carcasa.
ES1982273620U 1981-06-27 1982-06-25 Componente electronico del tipo insertado en una carcasa. Expired ES273620Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813125360 DE3125360A1 (de) 1981-06-27 1981-06-27 "elektronisches bauelement"

Publications (2)

Publication Number Publication Date
ES273620U true ES273620U (es) 1984-03-01
ES273620Y ES273620Y (es) 1984-10-01

Family

ID=6135531

Family Applications (1)

Application Number Title Priority Date Filing Date
ES1982273620U Expired ES273620Y (es) 1981-06-27 1982-06-25 Componente electronico del tipo insertado en una carcasa.

Country Status (4)

Country Link
JP (1) JPS586153A (es)
DE (1) DE3125360A1 (es)
ES (1) ES273620Y (es)
FR (1) FR2508705B1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4907067A (en) * 1988-05-11 1990-03-06 Texas Instruments Incorporated Thermally efficient power device package
JPH03185380A (ja) * 1989-12-14 1991-08-13 Furuno Electric Co Ltd 水中探知装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1369793A (fr) * 1962-09-21 1964-08-14 Westinghouse Electric Corp Dispositif semi-conducteur étanche
JPS432111Y1 (es) * 1964-05-23 1968-01-29
JPS5128829B1 (es) * 1968-10-21 1976-08-21
DE2064563A1 (de) * 1970-01-02 1971-07-08 Texas Instruments Inc Hermetisch abgedichteter Sockel
JPS4853256U (es) * 1971-10-26 1973-07-10
JPS502506U (es) * 1973-05-08 1975-01-11
JPS5093566A (es) * 1973-12-20 1975-07-25
JPS51113464A (en) * 1975-03-28 1976-10-06 Fujitsu Ltd Compound electronic component manufacturing system

Also Published As

Publication number Publication date
FR2508705A1 (fr) 1982-12-31
DE3125360C2 (es) 1989-11-30
FR2508705B1 (fr) 1985-12-27
ES273620Y (es) 1984-10-01
DE3125360A1 (de) 1983-01-13
JPH0558260B2 (es) 1993-08-26
JPS586153A (ja) 1983-01-13

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Legal Events

Date Code Title Description
FD1K Utility model lapsed

Effective date: 19970401