JPS5856499A - 厚膜回路基板の製造方法 - Google Patents
厚膜回路基板の製造方法Info
- Publication number
- JPS5856499A JPS5856499A JP15517381A JP15517381A JPS5856499A JP S5856499 A JPS5856499 A JP S5856499A JP 15517381 A JP15517381 A JP 15517381A JP 15517381 A JP15517381 A JP 15517381A JP S5856499 A JPS5856499 A JP S5856499A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- thick film
- hole
- circuit board
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 13
- 239000004020 conductor Substances 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 240000004808 Saccharomyces cerevisiae Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15517381A JPS5856499A (ja) | 1981-09-30 | 1981-09-30 | 厚膜回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15517381A JPS5856499A (ja) | 1981-09-30 | 1981-09-30 | 厚膜回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5856499A true JPS5856499A (ja) | 1983-04-04 |
| JPS6364918B2 JPS6364918B2 (enrdf_load_stackoverflow) | 1988-12-14 |
Family
ID=15600087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15517381A Granted JPS5856499A (ja) | 1981-09-30 | 1981-09-30 | 厚膜回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5856499A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61189696A (ja) * | 1985-02-18 | 1986-08-23 | 新光電気工業株式会社 | 多層セラミツク配線基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5467673A (en) * | 1977-11-09 | 1979-05-31 | Hitachi Ltd | Connector for multilayer print board |
| JPS5585097A (en) * | 1978-12-22 | 1980-06-26 | Fujitsu Ltd | Method of fabricating multilayer circuit board |
-
1981
- 1981-09-30 JP JP15517381A patent/JPS5856499A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5467673A (en) * | 1977-11-09 | 1979-05-31 | Hitachi Ltd | Connector for multilayer print board |
| JPS5585097A (en) * | 1978-12-22 | 1980-06-26 | Fujitsu Ltd | Method of fabricating multilayer circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61189696A (ja) * | 1985-02-18 | 1986-08-23 | 新光電気工業株式会社 | 多層セラミツク配線基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6364918B2 (enrdf_load_stackoverflow) | 1988-12-14 |
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