JPS5856442A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法Info
- Publication number
- JPS5856442A JPS5856442A JP56155102A JP15510281A JPS5856442A JP S5856442 A JPS5856442 A JP S5856442A JP 56155102 A JP56155102 A JP 56155102A JP 15510281 A JP15510281 A JP 15510281A JP S5856442 A JPS5856442 A JP S5856442A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- titanium
- transmitting window
- light transmitting
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56155102A JPS5856442A (ja) | 1981-09-30 | 1981-09-30 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56155102A JPS5856442A (ja) | 1981-09-30 | 1981-09-30 | 半導体装置およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5856442A true JPS5856442A (ja) | 1983-04-04 |
JPS6347148B2 JPS6347148B2 (enrdf_load_html_response) | 1988-09-20 |
Family
ID=15598659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56155102A Granted JPS5856442A (ja) | 1981-09-30 | 1981-09-30 | 半導体装置およびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5856442A (enrdf_load_html_response) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4766095A (en) * | 1985-01-04 | 1988-08-23 | Oki Electric Industry Co., Ltd. | Method of manufacturing eprom device |
JPH01229917A (ja) * | 1988-03-10 | 1989-09-13 | Nippon Soken Inc | 着火時期センサ |
JP2008277395A (ja) * | 2007-04-26 | 2008-11-13 | Kyocera Corp | 光素子用窓部材ならびに光素子収納用パッケージおよび光モジュール |
-
1981
- 1981-09-30 JP JP56155102A patent/JPS5856442A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4766095A (en) * | 1985-01-04 | 1988-08-23 | Oki Electric Industry Co., Ltd. | Method of manufacturing eprom device |
JPH01229917A (ja) * | 1988-03-10 | 1989-09-13 | Nippon Soken Inc | 着火時期センサ |
JP2008277395A (ja) * | 2007-04-26 | 2008-11-13 | Kyocera Corp | 光素子用窓部材ならびに光素子収納用パッケージおよび光モジュール |
Also Published As
Publication number | Publication date |
---|---|
JPS6347148B2 (enrdf_load_html_response) | 1988-09-20 |
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