JPS5847705Y2 - ダイ・コレツト - Google Patents

ダイ・コレツト

Info

Publication number
JPS5847705Y2
JPS5847705Y2 JP1979051616U JP5161679U JPS5847705Y2 JP S5847705 Y2 JPS5847705 Y2 JP S5847705Y2 JP 1979051616 U JP1979051616 U JP 1979051616U JP 5161679 U JP5161679 U JP 5161679U JP S5847705 Y2 JPS5847705 Y2 JP S5847705Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
receiving space
processed
die collet
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979051616U
Other languages
English (en)
Japanese (ja)
Other versions
JPS55152048U (enExample
Inventor
勝 根本
義昭 佐野
正泰 長島
浩 麦谷
亨 飯塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1979051616U priority Critical patent/JPS5847705Y2/ja
Publication of JPS55152048U publication Critical patent/JPS55152048U/ja
Application granted granted Critical
Publication of JPS5847705Y2 publication Critical patent/JPS5847705Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
JP1979051616U 1979-04-18 1979-04-18 ダイ・コレツト Expired JPS5847705Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979051616U JPS5847705Y2 (ja) 1979-04-18 1979-04-18 ダイ・コレツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979051616U JPS5847705Y2 (ja) 1979-04-18 1979-04-18 ダイ・コレツト

Publications (2)

Publication Number Publication Date
JPS55152048U JPS55152048U (enExample) 1980-11-01
JPS5847705Y2 true JPS5847705Y2 (ja) 1983-10-31

Family

ID=28941296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979051616U Expired JPS5847705Y2 (ja) 1979-04-18 1979-04-18 ダイ・コレツト

Country Status (1)

Country Link
JP (1) JPS5847705Y2 (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156558A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Collet for die bonding
JPS5653548Y2 (enExample) * 1977-06-09 1981-12-14

Also Published As

Publication number Publication date
JPS55152048U (enExample) 1980-11-01

Similar Documents

Publication Publication Date Title
US5633528A (en) Lead frame structure for IC devices with strengthened encapsulation adhesion
JP2001326236A (ja) 半導体装置の製造方法
US5249354A (en) Method of making electronic component packages
KR0156622B1 (ko) 반도체 패키지,리드프레임 및 제조방법
JP3308743B2 (ja) 電気接点および電気接点の作成方法
JPS5847705Y2 (ja) ダイ・コレツト
JP3446508B2 (ja) バンプ付きワークの実装方法および実装基板
JPH08241940A (ja) 半導体装置およびその製造方法
JPH05211256A (ja) 半導体装置
JPH07235621A (ja) リードレスチップキャリア及びその製造方法
JPS6384128A (ja) 混成集積回路装置
JPH0368157A (ja) 高周波用厚膜集積回路装置
JPS60254646A (ja) 半導体装置
JPH08264910A (ja) 放熱板付きプリント配線板の作製方法及びプリント配線板へのハイパワー部品の実装方法
JP2718146B2 (ja) 電子部品の製造方法
JPS6364916B2 (enExample)
JP2663986B2 (ja) 高集積度半導体装置
JPH0888293A (ja) 半導体実装装置およびこれを用いた半導体装置の実装方法
JPS61225827A (ja) 半導体素子の実装構造
JPH09129784A (ja) 半導体装置およびその製造方法
JP2505479B2 (ja) 半導体装置
JP2822446B2 (ja) 混成集積回路装置
JPS59224147A (ja) 半導体装置
JPS6220693B2 (enExample)
JPH0541460A (ja) 電子部品搭載用基板