JPS5847705Y2 - ダイ・コレツト - Google Patents
ダイ・コレツトInfo
- Publication number
- JPS5847705Y2 JPS5847705Y2 JP1979051616U JP5161679U JPS5847705Y2 JP S5847705 Y2 JPS5847705 Y2 JP S5847705Y2 JP 1979051616 U JP1979051616 U JP 1979051616U JP 5161679 U JP5161679 U JP 5161679U JP S5847705 Y2 JPS5847705 Y2 JP S5847705Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- receiving space
- processed
- die collet
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979051616U JPS5847705Y2 (ja) | 1979-04-18 | 1979-04-18 | ダイ・コレツト |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979051616U JPS5847705Y2 (ja) | 1979-04-18 | 1979-04-18 | ダイ・コレツト |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55152048U JPS55152048U (enrdf_load_stackoverflow) | 1980-11-01 |
JPS5847705Y2 true JPS5847705Y2 (ja) | 1983-10-31 |
Family
ID=28941296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1979051616U Expired JPS5847705Y2 (ja) | 1979-04-18 | 1979-04-18 | ダイ・コレツト |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5847705Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52156558A (en) * | 1976-06-23 | 1977-12-27 | Hitachi Ltd | Collet for die bonding |
JPS5653548Y2 (enrdf_load_stackoverflow) * | 1977-06-09 | 1981-12-14 |
-
1979
- 1979-04-18 JP JP1979051616U patent/JPS5847705Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS55152048U (enrdf_load_stackoverflow) | 1980-11-01 |
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