JPS5844745A - 半導体装置とその製法 - Google Patents
半導体装置とその製法Info
- Publication number
- JPS5844745A JPS5844745A JP56143064A JP14306481A JPS5844745A JP S5844745 A JPS5844745 A JP S5844745A JP 56143064 A JP56143064 A JP 56143064A JP 14306481 A JP14306481 A JP 14306481A JP S5844745 A JPS5844745 A JP S5844745A
- Authority
- JP
- Japan
- Prior art keywords
- amorphous silicon
- layer
- wiring
- silicon layer
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000012535 impurity Substances 0.000 claims description 6
- 238000010894 electron beam technology Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 20
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 239000000758 substrate Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56143064A JPS5844745A (ja) | 1981-09-10 | 1981-09-10 | 半導体装置とその製法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56143064A JPS5844745A (ja) | 1981-09-10 | 1981-09-10 | 半導体装置とその製法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11302890A Division JPH03114229A (ja) | 1990-04-26 | 1990-04-26 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5844745A true JPS5844745A (ja) | 1983-03-15 |
| JPH0335831B2 JPH0335831B2 (enrdf_load_stackoverflow) | 1991-05-29 |
Family
ID=15330067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56143064A Granted JPS5844745A (ja) | 1981-09-10 | 1981-09-10 | 半導体装置とその製法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5844745A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111563A (ja) * | 1984-11-05 | 1986-05-29 | Mitsubishi Electric Corp | 半導体装置の金属配線切断方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101607061B1 (ko) * | 2015-09-11 | 2016-03-28 | 양웅모 | 장작 가마 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4866979A (enrdf_load_stackoverflow) * | 1971-12-17 | 1973-09-13 |
-
1981
- 1981-09-10 JP JP56143064A patent/JPS5844745A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4866979A (enrdf_load_stackoverflow) * | 1971-12-17 | 1973-09-13 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111563A (ja) * | 1984-11-05 | 1986-05-29 | Mitsubishi Electric Corp | 半導体装置の金属配線切断方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0335831B2 (enrdf_load_stackoverflow) | 1991-05-29 |
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