JPS5844740A - 半導体集積回路 - Google Patents

半導体集積回路

Info

Publication number
JPS5844740A
JPS5844740A JP56142939A JP14293981A JPS5844740A JP S5844740 A JPS5844740 A JP S5844740A JP 56142939 A JP56142939 A JP 56142939A JP 14293981 A JP14293981 A JP 14293981A JP S5844740 A JPS5844740 A JP S5844740A
Authority
JP
Japan
Prior art keywords
cell
cells
wiring layer
internal
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56142939A
Other languages
English (en)
Japanese (ja)
Other versions
JPS643055B2 (enrdf_load_stackoverflow
Inventor
Satoru Tanizawa
谷澤　哲
Katsuharu Mitono
水戸野　克治
Hitoshi Omichi
大道　等
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56142939A priority Critical patent/JPS5844740A/ja
Priority to DE8282304746T priority patent/DE3276284D1/de
Priority to EP82304746A priority patent/EP0074805B2/en
Priority to IE2221/82A priority patent/IE54169B1/en
Publication of JPS5844740A publication Critical patent/JPS5844740A/ja
Priority to US06/769,800 priority patent/US4868630A/en
Publication of JPS643055B2 publication Critical patent/JPS643055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP56142939A 1981-09-10 1981-09-10 半導体集積回路 Granted JPS5844740A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP56142939A JPS5844740A (ja) 1981-09-10 1981-09-10 半導体集積回路
DE8282304746T DE3276284D1 (en) 1981-09-10 1982-09-09 Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers
EP82304746A EP0074805B2 (en) 1981-09-10 1982-09-09 Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers
IE2221/82A IE54169B1 (en) 1981-09-10 1982-09-10 Semiconductor integrated circuit comprising a semiconductor substrate and interconnecting layers
US06/769,800 US4868630A (en) 1981-09-10 1985-08-27 Gate array semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56142939A JPS5844740A (ja) 1981-09-10 1981-09-10 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS5844740A true JPS5844740A (ja) 1983-03-15
JPS643055B2 JPS643055B2 (enrdf_load_stackoverflow) 1989-01-19

Family

ID=15327152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56142939A Granted JPS5844740A (ja) 1981-09-10 1981-09-10 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS5844740A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985000468A1 (en) * 1983-07-14 1985-01-31 Advanced Micro Devices, Inc. A semiconductor die having undedicated input/output cells
US4879585A (en) * 1984-03-31 1989-11-07 Kabushiki Kaisha Toshiba Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985000468A1 (en) * 1983-07-14 1985-01-31 Advanced Micro Devices, Inc. A semiconductor die having undedicated input/output cells
US4879585A (en) * 1984-03-31 1989-11-07 Kabushiki Kaisha Toshiba Semiconductor device

Also Published As

Publication number Publication date
JPS643055B2 (enrdf_load_stackoverflow) 1989-01-19

Similar Documents

Publication Publication Date Title
JP3433731B2 (ja) Ｉ／ｏセル配置方法及び半導体装置
JPS6337650A (ja) 半導体記憶装置
JPH10270643A (ja) オン・ダイ型のデカップリング・キャパシタンスを有する半導体ダイ
JPS5844740A (ja) 半導体集積回路
JPS62261144A (ja) 半導体集積回路
JPS58139446A (ja) 半導体集積回路装置
JPH03272166A (ja) 半導体集積回路
JPS60145641A (ja) 半導体集積回路装置
JPH0123943B2 (enrdf_load_stackoverflow)
JPH04127556A (ja) 半導体集積回路
JPH025550A (ja) 半導体装置
JPH06283604A (ja) 半導体装置
JPS6290948A (ja) 半導体集積回路装置
JPS6252954A (ja) 半導体装置
JPS61225845A (ja) 半導体装置
JPH10173156A (ja) 半導体メモリのレイアウトサイズ削減方法
JPS63232352A (ja) マスタスライス方式半導体集積回路装置
JPS61150349A (ja) 半導体集積回路
JPH0246767A (ja) ゲートアレー方式の半導体集積回路
JPS6095935A (ja) ゲ−トアレイ集積回路装置
JPS62122234A (ja) ゲ−トアレイ
JPS5984455A (ja) 高密度メモリパツケ−ジ
JPS61245624A (ja) 半導体集積回路装置
JPH0580829B2 (enrdf_load_stackoverflow)
JPH0493047A (ja) 半導体集積回路装置