JPS5839051A - 絶縁基板に誘電体を形成する方法 - Google Patents

絶縁基板に誘電体を形成する方法

Info

Publication number
JPS5839051A
JPS5839051A JP56137210A JP13721081A JPS5839051A JP S5839051 A JPS5839051 A JP S5839051A JP 56137210 A JP56137210 A JP 56137210A JP 13721081 A JP13721081 A JP 13721081A JP S5839051 A JPS5839051 A JP S5839051A
Authority
JP
Japan
Prior art keywords
dielectric
circuit
conductive paste
copper conductive
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56137210A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0237083B2 (cg-RX-API-DMAC10.html
Inventor
Sandai Iwasa
山大 岩佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Laboratory Co Ltd
Original Assignee
Asahi Chemical Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Laboratory Co Ltd filed Critical Asahi Chemical Laboratory Co Ltd
Priority to JP56137210A priority Critical patent/JPS5839051A/ja
Publication of JPS5839051A publication Critical patent/JPS5839051A/ja
Publication of JPH0237083B2 publication Critical patent/JPH0237083B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP56137210A 1981-08-31 1981-08-31 絶縁基板に誘電体を形成する方法 Granted JPS5839051A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56137210A JPS5839051A (ja) 1981-08-31 1981-08-31 絶縁基板に誘電体を形成する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56137210A JPS5839051A (ja) 1981-08-31 1981-08-31 絶縁基板に誘電体を形成する方法

Publications (2)

Publication Number Publication Date
JPS5839051A true JPS5839051A (ja) 1983-03-07
JPH0237083B2 JPH0237083B2 (cg-RX-API-DMAC10.html) 1990-08-22

Family

ID=15193357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56137210A Granted JPS5839051A (ja) 1981-08-31 1981-08-31 絶縁基板に誘電体を形成する方法

Country Status (1)

Country Link
JP (1) JPS5839051A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6450700A (en) * 1987-07-30 1989-02-27 Lutron Electronics Co Radio output control system
JP2017224757A (ja) * 2016-06-16 2017-12-21 住友電工デバイス・イノベーション株式会社 キャパシタの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6450700A (en) * 1987-07-30 1989-02-27 Lutron Electronics Co Radio output control system
JP2017224757A (ja) * 2016-06-16 2017-12-21 住友電工デバイス・イノベーション株式会社 キャパシタの製造方法

Also Published As

Publication number Publication date
JPH0237083B2 (cg-RX-API-DMAC10.html) 1990-08-22

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