JPS5839027A - Mos型半導体装置の製造方法 - Google Patents

Mos型半導体装置の製造方法

Info

Publication number
JPS5839027A
JPS5839027A JP56137238A JP13723881A JPS5839027A JP S5839027 A JPS5839027 A JP S5839027A JP 56137238 A JP56137238 A JP 56137238A JP 13723881 A JP13723881 A JP 13723881A JP S5839027 A JPS5839027 A JP S5839027A
Authority
JP
Japan
Prior art keywords
region
film
isolation region
element isolation
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56137238A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6220697B2 (enrdf_load_stackoverflow
Inventor
Satoru Maeda
哲 前田
Hiroshi Iwai
洋 岩井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56137238A priority Critical patent/JPS5839027A/ja
Priority to US06/307,877 priority patent/US4560421A/en
Publication of JPS5839027A publication Critical patent/JPS5839027A/ja
Publication of JPS6220697B2 publication Critical patent/JPS6220697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76294Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using selective deposition of single crystal silicon, i.e. SEG techniques
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/112Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Element Separation (AREA)
JP56137238A 1980-10-02 1981-09-01 Mos型半導体装置の製造方法 Granted JPS5839027A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP56137238A JPS5839027A (ja) 1981-09-01 1981-09-01 Mos型半導体装置の製造方法
US06/307,877 US4560421A (en) 1980-10-02 1981-10-02 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56137238A JPS5839027A (ja) 1981-09-01 1981-09-01 Mos型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5839027A true JPS5839027A (ja) 1983-03-07
JPS6220697B2 JPS6220697B2 (enrdf_load_stackoverflow) 1987-05-08

Family

ID=15193996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56137238A Granted JPS5839027A (ja) 1980-10-02 1981-09-01 Mos型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5839027A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5061189A (enrdf_load_stackoverflow) * 1973-09-28 1975-05-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5061189A (enrdf_load_stackoverflow) * 1973-09-28 1975-05-26

Also Published As

Publication number Publication date
JPS6220697B2 (enrdf_load_stackoverflow) 1987-05-08

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