JPS5831421Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5831421Y2
JPS5831421Y2 JP1981167723U JP16772381U JPS5831421Y2 JP S5831421 Y2 JPS5831421 Y2 JP S5831421Y2 JP 1981167723 U JP1981167723 U JP 1981167723U JP 16772381 U JP16772381 U JP 16772381U JP S5831421 Y2 JPS5831421 Y2 JP S5831421Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
film
metal foil
hole
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981167723U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5794947U (enrdf_load_stackoverflow
Inventor
哲男 薮下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP1981167723U priority Critical patent/JPS5831421Y2/ja
Publication of JPS5794947U publication Critical patent/JPS5794947U/ja
Application granted granted Critical
Publication of JPS5831421Y2 publication Critical patent/JPS5831421Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1981167723U 1981-11-11 1981-11-11 半導体装置 Expired JPS5831421Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981167723U JPS5831421Y2 (ja) 1981-11-11 1981-11-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981167723U JPS5831421Y2 (ja) 1981-11-11 1981-11-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS5794947U JPS5794947U (enrdf_load_stackoverflow) 1982-06-11
JPS5831421Y2 true JPS5831421Y2 (ja) 1983-07-12

Family

ID=29526348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981167723U Expired JPS5831421Y2 (ja) 1981-11-11 1981-11-11 半導体装置

Country Status (1)

Country Link
JP (1) JPS5831421Y2 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50135062U (enrdf_load_stackoverflow) * 1974-04-23 1975-11-07

Also Published As

Publication number Publication date
JPS5794947U (enrdf_load_stackoverflow) 1982-06-11

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