JPS5824438Y2 - ワイヤボンダ - Google Patents

ワイヤボンダ

Info

Publication number
JPS5824438Y2
JPS5824438Y2 JP1978129782U JP12978278U JPS5824438Y2 JP S5824438 Y2 JPS5824438 Y2 JP S5824438Y2 JP 1978129782 U JP1978129782 U JP 1978129782U JP 12978278 U JP12978278 U JP 12978278U JP S5824438 Y2 JPS5824438 Y2 JP S5824438Y2
Authority
JP
Japan
Prior art keywords
bonding
servo motor
load
section
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978129782U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5547726U (https=
Inventor
登 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1978129782U priority Critical patent/JPS5824438Y2/ja
Publication of JPS5547726U publication Critical patent/JPS5547726U/ja
Application granted granted Critical
Publication of JPS5824438Y2 publication Critical patent/JPS5824438Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1978129782U 1978-09-20 1978-09-20 ワイヤボンダ Expired JPS5824438Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978129782U JPS5824438Y2 (ja) 1978-09-20 1978-09-20 ワイヤボンダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978129782U JPS5824438Y2 (ja) 1978-09-20 1978-09-20 ワイヤボンダ

Publications (2)

Publication Number Publication Date
JPS5547726U JPS5547726U (https=) 1980-03-28
JPS5824438Y2 true JPS5824438Y2 (ja) 1983-05-25

Family

ID=29094771

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978129782U Expired JPS5824438Y2 (ja) 1978-09-20 1978-09-20 ワイヤボンダ

Country Status (1)

Country Link
JP (1) JPS5824438Y2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3701652A1 (de) * 1987-01-21 1988-08-04 Siemens Ag Ueberwachung von bondparametern waehrend des bondvorganges

Also Published As

Publication number Publication date
JPS5547726U (https=) 1980-03-28

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