JPS5823944B2 - ヘンカンキノシドウホウホウ オヨビ ソウチ - Google Patents

ヘンカンキノシドウホウホウ オヨビ ソウチ

Info

Publication number
JPS5823944B2
JPS5823944B2 JP50117095A JP11709575A JPS5823944B2 JP S5823944 B2 JPS5823944 B2 JP S5823944B2 JP 50117095 A JP50117095 A JP 50117095A JP 11709575 A JP11709575 A JP 11709575A JP S5823944 B2 JPS5823944 B2 JP S5823944B2
Authority
JP
Japan
Prior art keywords
paint layer
photosensitive paint
developer
photosensitive
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50117095A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5160451A (en
Inventor
クルト・プレーネルト
ゲルハルト・ミツターフンマー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19742446368 external-priority patent/DE2446368C3/de
Priority claimed from DE19752529576 external-priority patent/DE2529576C3/de
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5160451A publication Critical patent/JPS5160451A/ja
Publication of JPS5823944B2 publication Critical patent/JPS5823944B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
  • Wire Bonding (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP50117095A 1974-09-27 1975-09-26 ヘンカンキノシドウホウホウ オヨビ ソウチ Expired JPS5823944B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19742446368 DE2446368C3 (de) 1974-09-27 Verfahren zur Herstellung von Mikroverdrahtungen zur Kontaktierung von Halbleiterschaltkreisen
DE19752529576 DE2529576C3 (de) 1975-07-02 1975-07-02 Vorrichtung zum einseitigen Entschichten eines Bandes

Publications (2)

Publication Number Publication Date
JPS5160451A JPS5160451A (en) 1976-05-26
JPS5823944B2 true JPS5823944B2 (ja) 1983-05-18

Family

ID=25767755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50117095A Expired JPS5823944B2 (ja) 1974-09-27 1975-09-26 ヘンカンキノシドウホウホウ オヨビ ソウチ

Country Status (6)

Country Link
US (1) US4057459A (US06566495-20030520-M00011.png)
JP (1) JPS5823944B2 (US06566495-20030520-M00011.png)
FR (1) FR2286579A1 (US06566495-20030520-M00011.png)
GB (2) GB1512793A (US06566495-20030520-M00011.png)
IT (1) IT1042837B (US06566495-20030520-M00011.png)
NL (1) NL7511259A (US06566495-20030520-M00011.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161352U (US06566495-20030520-M00011.png) * 1985-03-28 1986-10-06

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141782A (en) * 1978-01-30 1979-02-27 General Dynamics Corporation Bump circuits on tape utilizing chemical milling
JPS5530840A (en) * 1978-08-28 1980-03-04 Tokyo Shibaura Electric Co Method of manufacturing printed circuit board
US4339296A (en) * 1979-02-01 1982-07-13 Western Electric Co., Inc. Apparatus for adjustably forming pattern in a strip
US4320192A (en) * 1979-02-01 1982-03-16 Western Electric Co., Inc. Adjusting successive steps for making carrier tape
US4286860A (en) * 1979-02-01 1981-09-01 Western Electric Co., Inc. Apparatus for making carrier tape
US4227983A (en) * 1979-02-01 1980-10-14 Western Electric Company, Inc. Method for making carrier tape
JP3435323B2 (ja) * 1997-09-30 2003-08-11 大日本スクリーン製造株式会社 印刷装置および印刷装置に使用する印刷版の現像処理方法
GB0214066D0 (en) * 2002-06-19 2002-07-31 Eastman Kodak Co Photographic processor
FR2971065A1 (fr) * 2011-01-28 2012-08-03 Commissariat Energie Atomique Dispositif et procede de developpement de motifs a haut rapport de forme
CN109440108B (zh) * 2018-11-19 2020-06-16 浙江大学 一种基于化学刻蚀的铜箔穿孔机及其生产工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2665619A (en) * 1949-09-09 1954-01-12 Kenyon Instr Company Inc Apparatus for processing photographic film
US3774521A (en) * 1969-12-19 1973-11-27 Du Pont Photographic developing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61161352U (US06566495-20030520-M00011.png) * 1985-03-28 1986-10-06

Also Published As

Publication number Publication date
JPS5160451A (en) 1976-05-26
FR2286579B1 (US06566495-20030520-M00011.png) 1979-09-07
FR2286579A1 (fr) 1976-04-23
NL7511259A (nl) 1976-03-30
GB1512793A (en) 1978-06-01
GB1512794A (en) 1978-06-01
IT1042837B (it) 1980-01-30
US4057459A (en) 1977-11-08

Similar Documents

Publication Publication Date Title
JP2733771B2 (ja) 液体による処理装置
JPS5823944B2 (ja) ヘンカンキノシドウホウホウ オヨビ ソウチ
US4286860A (en) Apparatus for making carrier tape
KR920010779A (ko) 세정(洗淨)장치 및 그방법
KR101205821B1 (ko) 기판 처리 장치 및 기판 처리 방법
US5746903A (en) Wet chemical processing techniques for plating high aspect ratio features
US7553457B2 (en) Chemical processing apparatus for manufacturing circuit substrates
JP3237386B2 (ja) 洗浄・乾燥方法と洗浄装置
JPS6088944A (ja) レジスト膜の現像方法
JP2594577Y2 (ja) 基板のディップ処理装置
JPH05102118A (ja) 半導体ウエハの水洗方法および水洗槽
KR100464687B1 (ko) 레지스트의현상방법및현상장치
JPH09153475A (ja) 半導体洗浄乾燥方法および半導体洗浄乾燥装置
JPS61124940A (ja) レジスト膜の現像方法
JPH0310253A (ja) フォトマスクの処理方法
JP3282467B2 (ja) Ｔａｂテープキャリアの製造方法及びその製造装置
DE2529576A1 (de) Vorrichtung zum einseitigen entwickeln- bzw. entschichten eines bandes
SU38968A1 (ru) Способ и устройство дл изготовлени искусственных пленок из растворов целлюлозы в реактиве Швейцера
JPS6247125A (ja) 半導体装置の製造方法
JPH1195393A (ja) 処理タンクにおける処理液のオーバーフロー装置
JP3614999B2 (ja) 感光材料処理装置
DE2446368A1 (de) Verfahren zur herstellung von mikroverdrahtungen zur kontaktierung von halbleiterschaltkreisen
JPS582836A (ja) 現像方法
JPH04335645A (ja) フォトレジストの現像方法および現像装置
JPS598188B2 (ja) 浸漬装置