JPS58225657A - 多層混成集積回路 - Google Patents

多層混成集積回路

Info

Publication number
JPS58225657A
JPS58225657A JP57107873A JP10787382A JPS58225657A JP S58225657 A JPS58225657 A JP S58225657A JP 57107873 A JP57107873 A JP 57107873A JP 10787382 A JP10787382 A JP 10787382A JP S58225657 A JPS58225657 A JP S58225657A
Authority
JP
Japan
Prior art keywords
resistors
laser
conductive path
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57107873A
Other languages
English (en)
Japanese (ja)
Other versions
JPH049382B2 (https=
Inventor
Akira Kazami
風見　明
Masakazu Yamagishi
正和 山岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP57107873A priority Critical patent/JPS58225657A/ja
Publication of JPS58225657A publication Critical patent/JPS58225657A/ja
Publication of JPH049382B2 publication Critical patent/JPH049382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP57107873A 1982-06-22 1982-06-22 多層混成集積回路 Granted JPS58225657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57107873A JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57107873A JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Publications (2)

Publication Number Publication Date
JPS58225657A true JPS58225657A (ja) 1983-12-27
JPH049382B2 JPH049382B2 (https=) 1992-02-20

Family

ID=14470248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57107873A Granted JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Country Status (1)

Country Link
JP (1) JPS58225657A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
JPH0249169U (https=) * 1988-09-29 1990-04-05
DE19807956B4 (de) * 1997-02-26 2007-08-30 Denso Corp., Kariya Verfahren zum Trennen von Isoliersubstraten

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8784787B2 (en) 2009-10-23 2014-07-22 Dow Corning Toray Co., Ltd. Co-modified organopolysiloxane
US9580600B2 (en) 2009-10-23 2017-02-28 Dow Conring Toray Co., Ltd. Thickening or gelling agent for oily raw materials
WO2011078407A1 (en) 2009-12-24 2011-06-30 Dow Corning Toray Co., Ltd. Copolymer having carbosiloxane dendrimer structure, and composition and cosmetic containing the same
CN102686646B (zh) 2009-12-24 2015-08-19 道康宁东丽株式会社 用在化妆品中的粉末用的表面处理剂及含有用该表面处理剂处理的粉末的化妆品
EP2563844A1 (en) 2010-04-30 2013-03-06 Dow Corning Toray Co., Ltd. Organopolysiloxane and use thereof as surfactant, powder treatment agent, thickening agent of oil -based raw material or gelling agent. gel and emulsion compositions, as well as, preparations for external use and cosmetics comprising the same
WO2011136394A1 (en) 2010-04-30 2011-11-03 Dow Corning Toray Co., Ltd. Powder treatment agent comprising sugar alcohol -modified organopolysiloxane
WO2011136397A1 (en) 2010-04-30 2011-11-03 Dow Corning Toray Co., Ltd. Novel organopolysiloxane, surfactant, emulsion composition, powder treatment agent, thickening agent of oil-based raw material, gelling agent, gel composition, and cosmetic raw material comprising novel organopolysiloxane, as well as, preparation for external use and cosmetic comprising the same
US8715626B2 (en) 2010-07-30 2014-05-06 Dow Corning Toray Co., Ltd. Cosmetic for hair containing co-modified organopolysiloxane
JP2013095835A (ja) 2011-10-31 2013-05-20 Dow Corning Toray Co Ltd 長鎖アミド変性シリコーン・アミノ変性シリコーン共重合体及びその用途
JP6369888B2 (ja) 2011-12-27 2018-08-08 東レ・ダウコーニング株式会社 新規液状オルガノポリシロキサン及びその利用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558096A (en) * 1978-06-30 1980-01-21 Ibm Ic package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558096A (en) * 1978-06-30 1980-01-21 Ibm Ic package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
JPH0249169U (https=) * 1988-09-29 1990-04-05
DE19807956B4 (de) * 1997-02-26 2007-08-30 Denso Corp., Kariya Verfahren zum Trennen von Isoliersubstraten

Also Published As

Publication number Publication date
JPH049382B2 (https=) 1992-02-20

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