JPS58215289A - ダイボンデイング用はんだ - Google Patents
ダイボンデイング用はんだInfo
- Publication number
- JPS58215289A JPS58215289A JP9876582A JP9876582A JPS58215289A JP S58215289 A JPS58215289 A JP S58215289A JP 9876582 A JP9876582 A JP 9876582A JP 9876582 A JP9876582 A JP 9876582A JP S58215289 A JPS58215289 A JP S58215289A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tin
- composition
- silver
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 41
- 229910052718 tin Inorganic materials 0.000 claims abstract description 30
- 229910052709 silver Inorganic materials 0.000 claims abstract description 17
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 27
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 abstract description 21
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 21
- 239000010931 gold Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 229910017944 Ag—Cu Inorganic materials 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018731 Sn—Au Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9876582A JPS58215289A (ja) | 1982-06-09 | 1982-06-09 | ダイボンデイング用はんだ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9876582A JPS58215289A (ja) | 1982-06-09 | 1982-06-09 | ダイボンデイング用はんだ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58215289A true JPS58215289A (ja) | 1983-12-14 |
| JPH03158B2 JPH03158B2 (enrdf_load_html_response) | 1991-01-07 |
Family
ID=14228490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9876582A Granted JPS58215289A (ja) | 1982-06-09 | 1982-06-09 | ダイボンデイング用はんだ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58215289A (enrdf_load_html_response) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2584861A1 (fr) * | 1985-07-11 | 1987-01-16 | Nat Semiconductor Corp | Procede de fixation de pastilles semi-conductrices et produit resultant |
| JPS6272496A (ja) * | 1985-09-26 | 1987-04-03 | Matsuo Handa Kk | はんだ合金 |
-
1982
- 1982-06-09 JP JP9876582A patent/JPS58215289A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2584861A1 (fr) * | 1985-07-11 | 1987-01-16 | Nat Semiconductor Corp | Procede de fixation de pastilles semi-conductrices et produit resultant |
| JPS6272496A (ja) * | 1985-09-26 | 1987-04-03 | Matsuo Handa Kk | はんだ合金 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03158B2 (enrdf_load_html_response) | 1991-01-07 |
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